Other

Robert C Shelsky

Kenneth W Graham

Dennis D Everson

An interposer comprising an array of top contacts on the top surface configured to interface with an integrated circuit package, a corresponding array of bottom contacts on the bottom surface configured to interface with a component beneath the interposer, through connections between corresponding top and bottom contacts and a plurality of signal probe points on the edge surface. The interposer may include an electrical pathway connecting a first through connection to a first signal probe point. The electrical pathway may contact the first through connection at a first intersection. A resistor may be disposed along the electrical pathway, between the first intersection and the first signal probe point. The electrical pathway from the first intersection to the resistor may be an unconditioned signal pathway. The electrical pathway from the resistor to the first signal contact may be a conditioned signal pathway. The unconditioned signal pathway may have a length of not greater than 0.20 inch.

Interposer with signal-conditioned edge probe points

A test assembly that may provide access to signals of a circuit that includes an integrated circuit. The test assembly may include structural members that limit movement of components relative to each other.

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Nashua, NH, United States of America

Robert C Shelsky