St. Florian Company

Keteca Singapore Singapore

Robert C Runyon

Harold R Klievoneit

Augustine G Esposito

Che Kiong Hor

The present invention teaches a sawn wafer with ultra clean bonding pads on die which enhance the strength of wire bond and results in higher yield and improved reliability of packaged semiconductor die. Clean wafers ready for dicing are coated with a removable insulating water soluble non-ionic film which enhances clean saw cuts and reduces buildup. The protective film is hardened by heat and resists removal by cooling water used in dicing saws. However, after dicing the protective film is removable in a wafer washer using high pressure warm D.I. water. After removal of the protective film the electrode pads are virtually as clean as before dicing. The film may be used as a protective layer until the sawn wafer is ready for use.

Method and wafer for maintaining ultra clean bonding pads on a wafer

A dicing blade is formed by plating a composition of diamond particles and silicon carbide whiskers suspended in a nickel solution upon an aluminum hub. To obtain bonding rather than capturing of the diamond particles, nickel coated diamond particles may be used to form an inter-metallic bond between the coated diamond particles, the silicon carbide whiskers and the nickel matrix.

Dicing blade composition

Apparatus and a method are disclosed for grinding opposed faces of the hub of a dicing blade flat and parallel while preserving the capability of electroplating the hub with a membrane. Apparatus and a method are also disclosed for obtaining a single or dual rectilinear or curvilinear radial taper of the dicing blade.

Growing community of inventors

Sun City West, AZ, United States of America

Robert C Runyon