Sandisk Corporation

Sandisk Technologies Inc.

Matsushita Electric Industrial Co., Ltd.

Kabushiki Kaisha Toshiba

Socket Communications, Inc.

Robert C Miller

Hem P Takiar

Robert F Wallace

Edwin J Cuellar

Eli Harari

Joel Bernard Jacobs

Robert Andrew Howard

Wesley G Brewer

Yutaka Nakamura

Hiroyuki Yamada

Motohide Hatanaka

Warren Middlekauff

Hiroyuki Sakamoto

Matt Peterson

Steven Theodore Sprouse

Shrikar Bhagath

Suresh Kumar Upadhyayula

Ning Ye

Cheemen Yu

Leonard L Ott

Michael K Patterson

Andre McKenzie

Kevin M Conley

Itzhak Pomerantz

Carlos J Gonzalez

Yoram Cedar

Jeff Salazar

Kevin J Mills

Michael Gifford

Dhaval Parikh

Daniel Francis Kennedy

Patricio Collantes

Michael Alan Morganstern

Ka Ian Yung

Sanjay Dave

Ronald LaPedis

Christina Mei Chien Day

Peter Galat

Ning Liu

Timothy Miller

Thomas J Newman

Yishai Kagan

Anthony King

Allan Leafblad

Peter Phillips

Michael W Patterson

Jack Brandon

Jean-Christophe Klein

Eliyahou Harari

Jr Patricio Collantes

A USB memory assembly, and methods of forming same, are disclosed. The USB memory assembly includes a USB memory device within a carrier. The carrier may in turn be received within a connector shell and lid.

USB device with preassembled lid

A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.

Low profile wire bonded USB device

In a particular embodiment, a connector includes a connector module and a set of conductive connectors coupled to the connector module. The set of conductive connectors is configured to electrically couple to a set of contacts of a memory module. The connector also includes a ground contact coupled to the connector module. The ground contact is configured to be coupled to a ground of the memory module and to a conductive shroud.

Connector of a universal serial bus device

A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

System-in-a-package based flash memory card

A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD&#x2122; card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

Method of fabricating a memory card using SIP/SMT hybrid technology

Method of fabricating a memory card using SiP/SMT hybrid technology

A memory card connector, within a slot of a host device, for receiving a first memory card having a first row of contact fingers and a second row of contact fingers and a second memory card having only a single row of contact fingers. The memory card connector includes a first row of contact pins, a second row of contact pins and a protrusion. The first row of contact pins are configured to mate with the first row of contact fingers of the first memory card. The second row of contact pins are configured to mate with the second row of contact fingers of the first memory card. The protrusion is received within a contact finger in the second row of contact fingers of the first memory card to allow full insertion of the first memory card into the connector, and abuts against a distal end of one of the contact fingers of the second memory card to prevent full insertion of the second memory card into the connector.

Connector block feature

A portable memory storage device is disclosed where access to information on the device is granted only upon proper biometric authentication of a user. The device includes a controller, a non-volatile memory which may be a flash memory, and a biometric scanner system for controlling access to the information within the non-volatile memory. Each of the controller, non-volatile memory and biometric scanner system may be mounted in a base of the portable device, with the biometric system having an exposed surface on a top portion of the base for accepting biometric data such as a fingerprint. A cover is provided which includes a USB connector capable of mating within a USB port of the host device to establish communications between the portable and host devices. The cover also covers the exposed portion of the biometric scanner to protect the sensor when the portable memory storage device is not in use.

Portable memory storage device with biometric identification security

MicroSD memory card with a semi-transparent color surface

Method for preventing damage to a memory card

MicroSD memory card with different color surfaces

Growing community of inventors

San Jose, CA, United States of America

Robert C Miller