Eastman-Kodak Company

Robert C McConkey

John M Noonan

Michel Frantz Molaire

Gerald W Klein

Michael J Hanrahan

A flexible and nonbrittle negative-working photoresist composition comprises a polymeric binder, a photoinitiator composition, and a polymerizable cyclohexyleneoxyalkyl acrylate monomer characterized by the structural formula: ##STR1## wherein R is H or CH.sub.3,

Photoresist composition comprising cyclohexyleneoxyalkyl acrylates

A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises

Luminate for the formation of beam leads for IC chip bonding

Disclosed herein are heat-activatable adhesive compositions containing a water-dispersible polyester which comprises

Water-dispersible polyester adhesives for photographic materials

Disclosed herein are heat-activatable adhesive compositions comprising a water-soluble condensation polymer which is characterized by having a glycol component comprising one or more diols, preferably one of which is 1,4-bis(2-hydroxyethoxy)cyclohexane; and an acid component comprising greater than 15 and up to about 35 mole percent of at least one diacid or diester monomer having an iminodisulfonyl salt moiety, and from about 65 to about 85 mole percent of one or more other diacids or diesters. These adhesives are further characterized as having high bonding strengths at temperatures above 50.degree. C. They have been found useful in a variety of photographic materials, and particularly in image transfer film units.

Anionic imino-containing polymeric adhesives for photographic materials

Disclosed herein are heat-activatable adhesive compositions comprising a water-soluble condensation polymer which is characterized by having a glycol component comprising one or more diols, preferably one of which is 1,4-bis(2-hydroxy-ethoxy)cyclohexane; and an acid component comprising greater than 15 and up to about 35 mole percent of at least one diacid or diester monomer having an iminodisulfonyl salt moiety, and from about 65 to about 85 mole percent of one or more other diacids or diesters. These adhesives are further characterized as having high bonding strengths at temperatures above 50.degree. C. They have been found useful in a variety of photographic materials, and particularly in image transfer film units.

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Rochester, NY, United States of America

Robert C McConkey