Church Dwight & Co., Inc.

Other

Robert C Jorgensen

Anthony E Winston

M Stephen Lajoie

Francis R Cala

Alfredo Vinci

Benny S Yam

Steven E Dunn

William E Spears, Jr

A method of cleaning a solid surface which is particularly effective for a surface having a complicated structure including slots and holes comprises immersing the solid surface in a cleaning slurry comprising a cleaning liquid and abrasive particles which are soluble in the cleaning liquid, the cleaning liquid comprising a saturated solution so as to greatly reduce the dissolution of the abrasive particles in the cleaning liquid.

Slurry cleaning process

An improved slurry blasting process is disclosed wherein a liquid carrier medium such as water contains a dispersed water-soluble particulate abrasive to enhance blast cleaning efficiency and wherein the liquid carrier comprises a saturated solution such as the dissolved particulate abrasive so as to minimize the dissolution of the particulate abrasive therein. Slurry blasting at relatively low pressures below 500 psi and at room temperature provides effective and cost efficient cleaning of substrates. The slurry can be recovered and continuously reused. A recrystallization agent can be added to the slurry to increase abrasive particulate growth in the saturated solution.

Slurry blasting process

A method for removing rosin soldering flux with aqueous cleaning compositions. The aqueous cleaning compositions can be employed for household use or for cleaning electronic circuit assemblies. The aqueous cleaning compositions contain an alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned and an anionic polymer of a high molecular weight polyacrylic acid which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution.

Method for removing rosin soldering flux from a printed wiring board

The present invention is directed to aqueous cleaning compositions such as for household use or for cleaning electronic circuit assemblies comprising alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned and an anionic polymer comprising a high molecular weight polyacrylic acid which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution.

Stabilization of silicate solutions

The present invention is directed to aqueous cleaning concentrates such as for cleaning electronic circuit assemblies comprising 15-30 wt. % of a composition containing alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned, an anionic polymer comprising a high molecular weight polyacrylic acid which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution, surfactants, and a hydrotrope to maintain the surfactants in solution and the balance water.

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Cherry Hill, NJ, United States of America

Robert C Jorgensen