Minnesota Mining and Manufacturing Company

Other

3m Innovative Properties Company

Microelectronics and Computer Technology Corporation

Robert C Jordan

Gene B Portelli

Scott A Van Wert

Diana C Duane

Craig A Kapfer

Eric L Zilley

A method for creating a tamper-evident label is described. Embodiments of the method or process typically include four steps. In a first step, an ultraviolet cured ink mask can be printed onto a substrate by an inkjet printer. In a second step, once the printing is done and the mask has been formed, the substrate can be anodized in a weakened anodizing bath. In a third step, the ultraviolet cured ink can be removed from the substrate leaving a portion of the substrate unanodized. To remove the ultraviolet cured ink, the substrate can be heated to an elevated temperature and a cleaning solution and/or solvent can be applied to the ultraviolet cured ink mask. In a fourth step, the substrate can be anodized for a second time.

Method for creating tamper-evident labels

An adhesive tape for flexographic printing including a first adhesive layer, a substrate on the first adhesive layer, and a second adhesive layer on the substrate. The substrate preferably includes a polymeric film layer and a foam layer, wherein the topography of the first and second adhesive layers is substantially independent of the topography of the polymeric film layer. The polymeric film is preferably substantially smooth, and at least one of the first and second adhesive layers is preferably substantially continuous and includes a regular pattern of permanent grooves. The grooves preferably have a depth of about 4 &mgr;m to about 200 &mgr;m, and a width of about 4 &mgr;m to about 200 &mgr;m.

Flexographic printing elements with improved air bleed

A high density, high performance circuit fabricated with a copper/epoxy structure. The circuit is well suited for an integrated circuit interconnect device. Fluorene-containing epoxy resins may be used to obtain certain material and processing advantages over copper/polyimide structures. The circuit structure resides on a substrate which may be ceramic, a semiconductor such as silicon, or, advantageously, a cured epoxy resin.

Copper/epoxy structures

A fiber reinforced composite structure having a glass transition temperature greater than 150.degree. C. is comprised of:

Growing community of inventors

Saint Paul, MN, United States of America

Robert C Jordan