Robert Boschgmbh

Robert Bonasewicz

Andreas Krauss

Nicola Mingirulli

Marco Eitzert

Thomas Pagoni

Simon Mensak

A rotor for an electric machine, in particular for a brushless DC motor, includes a hollow cylindrical main body that is rotationally fixed to a machine shaft. The main body includes a plurality of radial protrusions arranged over its casing surface in the circumferential direction and in the axial direction and offset relative to one another by a defined offset angle. Each radial protrusion is limited over an angular range, which is smaller than the offset angle. The hollow cylindrical main body is permanently connected, in particular adhered, to a hollow cylindrical body surrounding same in the circumferential direction by way of a joining process. A method for producing a rotor for an electric machine is also disclosed. The method includes (i) using rotor laminations for a rotor lamination stack of the rotor, wherein a plurality of rotor laminations have a respective at least one radial protrusion that is limited over an angular range, (ii) stacking the rotor laminations to form the rotor lamination stack in such a way that, of the plurality of rotor laminations having at least one radial protrusion, neighboring rotor laminations are rotated relative to one another about a defined offset angle that is greater than the angular range of the at least one radial protrusion, (iii) applying a joining agent, in particular an adhesive, to an outer casing of the rotor lamination stack, preferably between the radial protrusions, and/or to an inner surface of a hollow cylindrical body, and (iv) sliding the hollow cylindrical body onto the rotor lamination stack. An electric machine is also disclosed that includes a corresponding rotor, as well as an electrical processing device having a corresponding electric machine.

Rotor for an electric machine and method for producing a rotor

At least one semiconductor component is packaged by covering at least one partial surface of the at least one semiconductor component with at least one chemically or physically dissoluble sacrificial material; surrounding the at least one semiconductor component at least partially with a photoablatable packaging material; exposing the sacrificial material on the at least one partial surface of the at least one semiconductor component at least partially by forming at least one trench through at least the packaging material using a light beam; and exposing the at least one partial surface of the at least one semiconductor component at least partially by at least partially removing the previously exposed sacrificial material using a chemical or physical removal method to which the packaging material has a higher resistance than the sacrificial material.

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Stuttgart, Germany

Robert Bonasewicz