Agere Systems Inc.

Robert B Crispell

John William Osenbach

Robert Scott Kistler

Mark Nelson

The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.

Plastic overmolded packages with mechancially decoupled lid attach attachment

The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.

Plastic overmolded packages with mechanically decoupled lid attach attachment

A sealing package for an integrated circuit chip including a lead structure with first lead members and second lead members. The first lead members are located proximate the corners of the sealing package and have two lead portions external to the sealing package and one lead portion internal to the sealing package. The second lead members are fanned out along the sides of the sealing package and have one lead portion internal to the sealing package and one lead portion external to the sealing package. Each first lead member adapted to provide a connection to ground for at least two sides of the sealing package. Each second lead member adapted to provide a connection between an integrated circuit chip internal to the sealing package and external circuitry.

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Whitehall, PA, United States of America

Robert B Crispell