International Business Machines Corporation

Endicott Interconnect Technologies, Inc.

Robert Anthony Sinicki

John Joseph Konrad

Roy H Magnuson

Ross William Keesler

A photoresist composition, e.g., a positive acting resist, for use in the formation of circuit patterns and the like on printed circuit boards and the like circuitized substrates, the photoresist composition including a quantity of silver therein in a sufficient amount to substantially prevent bacteria formation within said composition. A method of making the composition is also provided.

Photoresist composition with antibacterial agent

A method of analyzing for As(III) as AsO.sub.2.sup.-1 ion in an Au(I) containing electroplating solution. The concentration of As(III) in the electroplating solution is maintained high enough to avoid formation of 'burnt Au' oxides but low enough to avoid bond failures. A sample of the electroplating solution is withdrawn and added to a buffered solution, for example an acetate-ethylene diamine tetraacetic acid (EDTA) buffered solution. A complexing agent for Au(I) ion is added to the buffered solution. This can be an alkali metal cyanide. Next ammonium pyrrolidine dithiocarbamate is added as a complexing agent for the AsO.sub.2.sup.-1 ion. The ammonium pyrrolidine dithiocarbamate--AsO.sub.2.sup.-1 ion is extracted, for example with methyl isobutyl ketone (MIBK). The extract is analyzed for As(III) by atomic absorption, as electrothermal atomic absorption spectrometry.

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Endwell, NY, United States of America

Robert Anthony Sinicki