Texas Instruments Corporation

Robert Alvarez

Anthony M Chiu

Paul R Moehle

Tony Chiu

Harold T Kellher

Jay Alexander

The invention is a leadframe/stabilizer () for use with semiconductor devices. Stabilizer () is for stabilizing the space between of lead frame leads () and improving the lead to lead spacing and to improve lead tip planarity. Stabilizer () extends partially along the length of and on each side of said lead frame leads () and include a die pad mount (), integral with and forming a part of said stabilizer

Stabilizer/spacer for semiconductor device

The invention disclosed herein is a device and method in which a heat sink (,) is attached to support leads (,) of a leadframe (,) via a welding or mechanical joining technique. The method is performed prior to semiconductor device packaging and is usually performed after the leadframe is etched or stamped, and before it is cut into strips.

Low cost heat sink for packaged semiconductor device

A lead frame design and manufacturing process comprising a lead frame (18) having its internal lead fingers (20) punched out to dimensions optimized to accommodate the body size of a selected die. A die pad (30), also optimized to accommodate the body size of the selected die, is attached to the lead frame with mechanical or chemical bonding. Punches are used to punch out the internal lead pins according to selected dimensions.

Process for manufacturing a lead frame

The invention disclosed herein is a device and method in which a heat sink (22) is attached to support leads (18) of a leadframe (10) via a welding or mechanical joining technique. The method is performed prior to semiconductor device packaging and is usually performed after the leadframe is etched or stamped, and before it is cut into strips.

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Garland, TX, United States of America

Robert Alvarez