Corning Incorporated

Tyco Electronics Corporation

Inplane Photonics, Inc.

Corning Incorporarted

Robert Addison Boudreau

Gary Edward Merz

Douglas Edward Brackley

Songsheng Tan

Kevin Thomas Gahagan

Leon Robert Zoeller, Iii

Charles Andrew Paulson

Kevin Lee Wasson

Gary Richard Trott

Darwin Gene Enicks

Raymond Charles Cady

Ying Zhang

James Paul Peris

Lawrence Charles Hughes

Karen Irene Matthews

Chris P Brophy

Mark F Krol

Deepukumar M Nair

Aniruddha S Weling

Christopher L Henning

Christian Drabenstadt

Jeffery Emerson Schramm

A method of coating a surface of a glass ribbon during a drawing process using atmospheric vapor deposition is provided. The method includes forming a glass ribbon in a viscoelastic state, desirably with a fusion draw. The glass ribbon is drawn in the viscoelastic state. The glass ribbon is cooled in the viscoelastic state into an elastic state. The glass ribbon is directed into an open end of a reactor. The reactor includes multiple channels. A first channel directs a first reactant gas, a second channel directs a second reactant gas and one or more third channels draw excess reactant, or purge it with inert gas flow, or both.

Vapor deposition systems and processes for the protection of glass sheets

A lenticular system for autostereoscopic display devices in which a transparent polymeric lenticular array is embedded between two glass sheets and the gap between the polymeric lenticular array and the outer cover is filled with a transparent polymeric filling having a refractive index different than the refractive index of the polymeric lenticular array to reduce glare.

Glass encapsulated polymeric lenticular system for autostereoscopic display

Apparatus and methods for non-contact testing of electronic components printed on a substrate () are provided. Test circuits () are printed on the substrate () at the same time as the desired electronic component. The test circuits () are all optical and include a first portion () for providing electrical energy for the test circuit () and a second portion () for generating a detectable optical signal that is indicative of at least one electrical property of the electronic component. The test circuits are used in real time and minimize the production of unusable scrap in the printing of such products as ePaper.

Non-contact testing of printed electronics

A print press system and a method are described herein that print an electronic circuit onto a material (e.g., glass substrate, plastic film, plastic film-glass substrate laminate). In exemplary applications, the print press system can print an electronic circuit onto a material to form, for instance, a flexible Liquid Crystal Display, a retail point of purchase sign and an e-book.

Roll mechanics for enabling printed electronics

A method and apparatus is provided for attaching a bulk element processing an optical beam to a PLC and optically aligning the bulk element with an optical element formed on the PLC. The method begins by securing the bulk element to a first side of a substrate. A first side of a flexure element is secured to the first side of the substrate. A second side of the flexure element is secured to a first side of the PLC on which the optical element is formed such that the bulk element and the optical element are in optical alignment to within a first level of tolerance. Subsequent to the step of securing the second side of the flexure element, a force is exerted on at least a second side of the substrate to thereby flex the flexure element. The force causes sufficient flexure of the flexure element to optically align the bulk element and optical element to within a second level of tolerance that is more stringent than the first level of tolerance.

Active optical alignment and attachment thereto of a semiconductor optical component with an optical element formed on a planar lightwave circuit

A process comprising: (a) applying a stop etch mask to a substrate, the mask defining the location on the substrate of a groove for receiving a waveguide and one or more fiducials for positioning the optical device on the substrate relative to the waveguide; and (b) etching the substrate to define the fiducials and the groove, the groove being dimensioned to receive at least a portion of a waveguide and the fiducials enabling the optical device to be positioned on the substrate such that it is optically aligned with the waveguide.

Optical substrate having alignment fiducials

An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.

Multiple fiber chip clamp

An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.

Ceramic waferboard for integration of optical/optoelectronic/electronic components

An opto-electronic packaged platform ( ) includes a high resistivity substrate ( ) having an optical waveguide mounting portion ( ), an optical device mounting portion ( ), and an electrical waveguide portion ( ) having a conductor pattern ( ) and an underlying capacitance ( and/or ) forming a transmission line ( ) for propagating high frequency signals.

Growing community of inventors

Corning, NY, United States of America

Robert Addison Boudreau