Network Engines, Inc.

Ati Technologies Ulc

Other

Ati Technologies Inc.

Network Engineers, Inc.

Robert A Wiley

Jerry Jarvis

David Potter

Gamal Refai-Ahmed

Jim E Loro

Nima Osqueizadeh

Salim Lakhani

Joanne Sheehan

Christopher S Bonni

Steven Chan

Thomas Savage

James Harvey Smith

Lawrence Genovesi

A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal spreader is mountable to the circuit substrate to thermally couple with the second heat generating component. Additionally, the second thermal spreader is adapted to couple to the first thermal spreader to thermally couple the first thermal spreader to the first heat generating component when the second thermal spreader is mounted to the circuit substrate. The thermal management device also includes a bias device that is coupled to the first thermal spreader and the second thermal spreader and is adapted to maintain the thermal coupling between the first thermal spreader and the first heat generating component when the second thermal spreader is mounted to the circuit substrate.

Thermal management device for multiple heat producing devices

A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.

Variable spring rate thermal management apparatus attachment mechanism

The invention herein pertains to improved methods and apparatus for electrically coupling components within a digital data system without the use of ribbon cables and other wires. The disclosed coupling device comprises a body member and at least one finger member. The body member physically and electrically couples with components mounted on a circuit board by mating with component pins extending on a solder side of the circuit board. The finger member is conjoined with the body member, and is a flexible, twistable, thin member containing electrically conductive vias coupled which couple the mounted components with an electrical connected located at the distal end of the finger member. The electrical connector at the distal end of the finger member can be a solder pad, a further member body, or other electrically coupling connector device. The finger member is designed to impact cooling air flow less than the disturbances created by conventional component coupling methods and apparatus, e.g., ribbon cable and wires, thereby increasing the effective heat dissipation within the digital data system.

Signal conducting applique and method for use with printed circuit board

The present invention is directed to a chassis slide assembly comprised of a mating rail and track that telescopically engage with one another and that are adapted for coupling to a chassis and to a rack to allow the chassis to be pulled out from the rack for inspection, service or repair. The rail and track each have at least one air flow aperture positioned to allow unobstructed venting of air through the slide assembly and through the side wall of the chassis. In one embodiment, the rail and track have a plurality of airflow apertures. The apertures of the rail and track can consist of a large-area openings, or of a plurality of slots or perforations. In one embodiment, the apertures of the rail are substantially aligned with the apertures of the track, e.g. when the rail and track are fully engaged with one another. An advantage of the present invention is that the additional air flow apertures in the chassis slide provide improved air flow through out the chassis, thereby reducing the possibility of overheating and component failure.

Ventilating slide rail mount

A riser card, such as a peripheral component interconnect (PCI) card, attaches to a circuit board such as a mother board in a transverse orientation and has a first connector and a second connector attached to opposing sides of the card for receiving expansion cards. In one embodiment, the first connector is offset from the second connector with respect to an axis in the plane of the riser card. In another embodiment, the first and second connectors each have a first and last pin, and the first pin of the first card is opposite the first pin of the second connector. The riser card may mount one expansion board right side up, and the second board upside down. The first and second connectors can be female connectors which are each matable with a male connector on the corresponding expansion board, or can be card edge connectors. The expansion boards, when mated with the connectors, are substantially parallel to, but offset from the circuit board. Advantageously, the expansion boards consume less space in the housing by sharing a single riser card, and overall bus length may be substantially reduced between components in addition to providing additional, more open, or better channel space for cooling air flow. A preferred embodiment mounts centrally on a mother board, and provides two side channels for air flow cooling through the chassis of a rack-mounted web server data processor device.

Circuit board riser

A digital data processing device, e.g., a web server, having a power supply and at least one component such as a motherboard or a disk drive powered by the power supply and interconnected therewith by a power transfer element which is separate from the power supply and the component. The power transfer element is adapted to physically mate with the power supply and the powered component and to provide electrical coupling between them along a non-obstructing path of defined geometry. It includes a substantially rigid card, e.g. a circuit card, with at least one conductive pathway, and further aspects of the invention provide mechanisms for coupling the power transfer element to the supply and to the other component while orienting the card within the chassis. The power transfer card may carry an edge connector into which the edge of a power supply card fits, or vice-versa, so power enters conductors on the card at a proximal edge or end of the card. The conductors run to one or more lands positioned to couple power from conductive pathways out by direct contact to one or more conductive posts or stand-offs. Thus the card mounts parallel to one or more other boards, or devices, or is positioned parallel to a cooling air flow with minimally obstructive cross-section, and is securely held in a defined position and geometry within the chassis.

Power supply for low profile equipment housing

The present invention is directed to a ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or housing, such as the housing of a web server, or of a storage array device for a network server or web server. The cooling element includes a fan that is disposed at an angle to integrate its cooling air with general circulation or air flow through the chassis. The element may mount on a plate, such as the thermally conductive plate of a heat sink, that is adapted for coupling to the chassis and/or contacting a microprocessor chip, and a fan is disposed on the mounting plate at an angle to cool the plate or chip without creating obstructive cross wind. The mounting plate can be disposed within the middle portion of the chassis. The fan or cooling element can be angled so as to direct airflow towards at least a selected portion of the chassis, e.g. along a flow path to a chassis vent or opening, which may be in the rear portion. The mounting plate can also include one or more a thermally conductive heat dissipation members, such as fins or posts, and the fan may have a side-to-side tilt as well as an inclination with respect to the plane of the plate.

Low profile equipment housing with angular fan

A low profile, high density storage array includes a digital data storage unit, such as a rack-mount chassis, and a plurality of digital data storage devices such as disk drives, disposed within the array. The drives are spaced apart from a floor of the array on which they are mounted, e.g., via supporting &ldquo;sleds.&rdquo; In addition to facilitating insertion and removal of the drives from the array, air flow through or beneath these sleds cool the drives. The drives can be removably attached to the array via cam-like levers that facilitate mounting and dismounting of the drives from the chassis and its electrical circuitry.

Low profile, high density storage array

A liquid delivery system for a marine vessel or a road vehicle is provided which comprises a flexible bladder for housing a liquid, a portable pump, a protective housing for the pump, a pump switch and conduits for connecting the bladder, the pump and a container for liquid or the vessel or vehicle.

Fluid delivery system for a road vehicle or water vessel

The present invention is directed to ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or housing, such as the housing of a web server, or of a storage array device for a network server or web server. The cooling element includes a fan that is disposed at an angle to integrate its cooling air with general circulation or air flow through the chassis. The element may mount on a plate, such as the thermally conductive plate of a heat sink, that is adapted for coupling to the chassis and/or contacting a microprocessor chip, and a fan is disposed on the mounting plate at an angle to cool the plate or chip without creating obstructive cross wind. The mounting plate can be disposed within the middle portion of the chassis. The fan or cooling element can be angled so as to direct airflow towards at least a selected portion of the chassis, e.g. along a flow path to a chassis vent or opening, which may be in the rear portion. The mounting plate can also include one or more a thermally conductive heat dissipation members, such as fins or posts, and the fan may have a side-to-side tilt as well as an inclination with respect to the plane of the plate.

Growing community of inventors

Topsfield, MA, United States of America

Robert A Wiley