Omi International Corporation

Oxy Metal Industries Corporation

Occidental Chemical Corporation

Hooker Chemicals & Plastics Corporation

Ebara-Udylite Co., Ltd.

Robert A Tremmel

Richard John Clauss

Doina Magda

Sylvia Martin

Roy W Herr

Thaddeus W Tomaszewski

Lillie C Tomaszewski

Walter J Wieczerniak

Masaaki Kamitani

Kenneth D Snell

Daniel J Combs

Ryoichi Kimizuka

Donald Harvey Becking

Larry T Rudolph

Takaaki Koga

An improved process for purifying a nickel plating bath including a pyridine composition as an additive and which bath contains a breakdown product of the pyridine composition. The process has the following steps:

Process for purification of nickel plating baths

An aqueous acidic electrolyte of the chloride, sulfate and mixed chloride-sulfate types suitable for electrodepositing a zinc-nickel alloy on a conductive substrate comprising an aqueous solution containing zinc ions and nickel ions, and an additive agent of a class selected from the group consisting of (a) aromatic sulfonic acids, (b) aromatic sulfonamides, sulfonimides and mixed carboxamides/sulfonamides, (c) acetylene alcohols as well as the bath soluble and compatible salts and mixtures thereof. The invention further encompasses the process for electrodepositing a zinc-nickel alloy employing the aforementioned electrolyte.

Zinc-nickel alloy electrolyte and process

An improved process for producing a composite nickel-containing electroplate on a substrate including an inner nickel-containing layer, of an average sulfur content of less than about 0.03 percent by weight, an intermediate nickel-containing layer of an average sulfur content of about 0.05 to about 0.5 percent by weight and an adjacent adherent outer nickel layer of an average sulfur content of about 0.02 to about 0.15 percent but less in sulfur than the intermediate layer and higher in sulfur than the inner layer. The controlled amount of sulfur is introduced into at least the intermediate layer by employing an aqueous acidic nickel solution containing a controlled amount of a thiazole and/or thiazoline additive compound so as to provide an intermediate nickel-containing deposit containing the specified average sulfur content.

Process for electrodepositing composite nickel layers

An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates in which the electrolyte contains copper ions in an amount sufficient to electrodeposit copper, a complexing agent present in an amount sufficient to complex an effective amount of the copper ions present, a bath soluble and compatible buffering agent present in an amount sufficient to stabilize the pH of the electrolyte, hydroxyl and/or hydrogen ions present in an amount to provide a pH of about 6 to about 10.5, and sulfamic acid and the bath soluble and compatible salts thereof present in an amount effective to increase the anode efficiency during the electrodeposition of copper from said electrolyte. The electrolyte can optionally, but preferably further contain ammonium ions in combination with the sulfamic acid constituent to further enhance the anode efficiency and a wetting agent present in an amount up to about 2 g/l. The process for electrodepositing copper employing the foregoing electrolyte is performed employing a combination of insoluble anodes and soluble copper anodes adjusted to attain replenishment of the copper ions consumed by the oxidation and dissolving of the copper anode.

Cyanide-free copper electrolyte and process

A process for electrodepositing chromium on a conductive substrate employing an electrolyte containing trivalent chromium ions, a complexing agent, and hydrogen ions to provide an acidic pH in which a conductive substrate to be electroplated is immersed in the electrolyte and is cathodically charged and current is passed between the substrate and an anode at least a portion of the surfaces of which is comprised of ferrite whereby the formation of detrimental hexavalent chromium ions in the electrolyte is inhibited and the stability of the pH of the electrolyte is improved.

Trivalent chromium electroplating process

A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agent, and hydroxyl and/or hydrogen ions to provide a pH from about 6 to about 10.5. The process includes electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble nickel-iron alloy anode containing about 10 percent to about 40 percent by weight iron and about 0.005 to about 0.06 percent sulfur to provide a copper anode area to nickel-iron alloy anode surface area ratio within a range of about 1:2 to about 4:1. The invention further contemplates a novel nickel-iron alloy anode for use in the practice of the disclosed process.

Cyanide-free copper plating process

An aqueous bath and process suitable for the electrodeposition of bright, high-leveling nickel-iron alloy deposits on a conductive substrate comprising controlled, effective amounts of nickel ions, iron ions, an iron solubilizing agent, a buffering agent, a primary brightening agent, hydrogen ions to provide a pH of about 2.6 to 4.5 and at least one bath soluble additive agent present in an amount of at least about 2 mg/l, selected from propargyl sulfonic acid, 1-butyne-3-sulfonic acid, 1-pentyne-5-sulfonic acid, 2-butyne-1-sulfonic acid and the alkali metal and ammonium salts thereof. A particularly preferred additive agent comprises propargyl sulfonic acid and the alkali metal and ammonium salts thereof. The invention further contemplates the use of the aforementioned additive agent as a replenishing agent for nickel-iron electroplating solutions and as a rejuvenating agent for restoring the activity and capacity of such aqueous baths to deposit bright, high-leveling nickel-iron alloy deposits.

Bright nickel-iron alloy electroplating bath and process

A process and electroplating bath for use in electrodepositing nickel on a base where the electroplating bath includes a coumarin compound and an aryl hydroxy carboxylic acid compound, such as salicylic acid, present in a combined amount effective to provide a ductile, self-leveling nickel deposit. The bath may further include hexyne diol and/or a material selected from the group consisting of primary acetylenic alcohols and adducts of primary acetylenic alcohols, as well as mixtures thereof. It has been found that excellent leveling and physical properties can be maintained utilizing such a bath, while at the same time, the usual coumarin concentration level can be reduced significantly and process life can be dramatically extended. In addition, additives such as butyne diol, and/or aldehydes such as formaldehyde and chloral hydrate may be utilized. It has also been found that corrosion resistance is substantially improved utilizing the process and electroplating bath of the present invention.

Coumarin process and nickel electroplating bath

An improved aqueous acidic trivalent chromium electrolyte and process for increasing the tolerance of such electrolytes to the presence of deleterious contaminating metal ions which normally progressively increase during commercial operation of the electrolyte ultimately resulting in chromium electrodeposits which are commercially unsatisfactory due to the presence of streaks, clouds and hazes in the deposit. The improved composition contains controlled effective amounts of thiazole and benzothiazole compounds which are effective to mask the adverse effects of such contaminating metal impurities and which also enhance the codeposition of such metal contaminants on the parts being plated thereby reducing, and in some instances preventing the progressive accumulation of such contaminating metal ions in the electrolyte. The invention further encompasses the process of rejuvenating trivalent chromium electrolytes which have been rendered deficient in their ability to deposit satisfactory chromium platings by a controlled addition of such additive agents followed by electrolyzing of the electrolyte to progressively reduce the concentration of contaminating metal ions to a level in which satisfactory performance of the electrolyte is restored.

Trivalent chromium electroplating baths and processes using thiazole

A composite electroplated article and process for making same comprising a body having a plurality of adherent electroplates of controlled thickness and composition thereon. The first layer comprises a nickel-iron alloy containing about 15 to about 50 percent by weight iron; the second layer comprises a nickel-containing plate of a sulfur content of about 0.02 to about 0.5 percent by weight; the third layer comprises a nickel-iron alloy containing about 5 to about 19 percent by weight iron but less iron than the first layer. Optionally, a decorative chromium outer layer is applied to the surface of the third layer, and preferably, an intervening nickel plate is interposed between the third layer and outer chromium layer of a type selected to induce micro-discontinuities in the outer chromium layer.

Composite electroplated article and process

An improved composition and process for producing a composite nickel-containing electroplate on a substrate including an inner nickel-containing layer of an average sulfur content of less than about 0.03 percent by weight, an intermediate nickel-containing layer of an average sulfur content of about 0.05 to about 0.5 percent by weight and an adjacent adherent outer nickel layer of an average sulfur content of about 0.02 to about 0.15 percent but less in sulfur than the intermediate layer and higher in sulfur than the inner layer. The controlled amount of sulfur is introduced into at least the intermediate layer by employing an aqueous acidic nickel solution containing a controlled amount of a thiazole compound so as to provide an intermediate nickel-containing deposit containing the specified average sulfur content.

Process for electro-depositing composite nickel layers

A bath composition and method for electrodepositing a cobalt-zinc alloy on a conductive substrate which simulates the appearance of a conventional chromium electrodeposit. The bath comprises an aqueous solution having a pH of about 6 to about 9 containing a controlled ratio of cobalt ions and zinc ions and a complexing agent sufficient to maintain the cobalt and zinc ions in solution. The bath and method are particularly adaptable for rack plating articles to impart a decorative bright chromium-like appearance and semi-bright deposits simulating conventional chromium platings.

Bath composition and method for electrodepositing cobalt-zinc alloys

An aqueous bath and process for the electrodeposition of bright, high-leveling nickel-iron alloy deposits on a conductive substrate comprising controlled effective amounts of nickel ions, iron ions, a bath soluble tartrate complexing agent, a reducing mono or disaccharide, ascorbic and/or isoascorbic acid, a buffering agent, a mixture of primary and secondary nickel brightening agents and hydrogen ions to provide a pH of about 2.6 to about 4.5.

Electroplating bath and process for producing bright, high-leveling

An aqueous bath suitable for the electrodeposition of a bright iron-nickel electrodeposit onto a substrate susceptible to corrosion comprising iron ions, nickel ions, a bath soluble primary nickel brightener containing a sulfo-oxygen group, a bath soluble complexing agent, and an auxiliary bath soluble nickel brightener containing a sulfo-oxygen group, said auxiliary brightener having the general formula:

Electrodeposition of nickel-iron alloys

The instant invention is directed to an aqueous bath for the electrodeposition of a bright iron-nickel alloy and to a process utilizing the same, the bath comprising iron ions, nickel ions, an iron complexing agent containing at least two complexing groups independently selected from the group consisting of carboxy and hydroxy provided at least one group is a carboxy group, and a reaction product of a polyamine and an alkylating or sulfonating agent, whereby there is achieved a marked improvement in the brightness of the electrodeposit as well as excellent leveling in both the high and low current density areas. Optionally, by the addition of acetylenic brighteners of a particular structural formula even further improved results may be obtained.

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Woodhaven, MI, United States of America

Robert A Tremmel