Chevron Research Company

Robert A Stayner

Richard C Fox

Thornton K Jones

Warren Lowe

Thorton K Jones

Alfred Goldschmidt

Disclosed is an oil-in-water micro-emulsion comprising 0.09 to 49.99 percent by mass oil, 50 to 99.9 percent by mass of water, and 0.01 to 10 mass percent of an antiwear agent.

Oil-in-water microemulsion fluid

Disclosed is an oil-in-water emulsion comprising 0.99 to 50 percent by mass oil, 50 to 99 percent by mass of water, and 0.01 to 10 mass percent of an alkali metal borate.

Borate-containing oil-in-water microemulsion fluid

Disclosed is a water-in-oil emulsion fluid comprising 0.99 to 50 percent by mass water, 50 to 99 percent by mass oil, and 0.01 to 10 mass percent of an alkali metal borate.

Borate-containing water-in-oil microemulsion fluid

Disclosed is a process for joining two metal surfaces together with solder in which the surfaces to be soldered are first treated with an organic phosphorus-containing liquid flux which is relatively non-corrosive and which has a high degree of lubricity.

Process for soldering using a phosphorus-containing liquid flux

Disclosed is a water-rinsable soldering fluid comprising a mixture of a polyalkylene ether and a polyamide. The polyamide is formed from the reaction of a carboxylic acid and a polyalkylene polyamine.

Water-rinsable soldering fluid containing a polyamide dispersant

Wax-flux compositions for use in soldering processes comprising: (a) a major amount of a wax; and (b) an effective amount to cause fluxing, at or below the temperature of the piece to be soldered, of a wax-dispersible C.sub.12 to C.sub.28 aliphatic carboxylic acid.

Carboxylic acid-containing wax fluxes

Wax-flux compositions for use in soldering processes comprising: (a) a major amount of a wax; and (b) an effective amount to cause fluxing, at or below the temperature of the piece to be soldered, of a wax-soluble, phosphorus-containing acid.

Wax flux compositions

Disclosed is a wax-flux composition and a process for making a wax-flux composition comprising a normally solid chlorinated wax having a chlorine content below about 60 weight percent.

Chlorinated wax flux compositions

Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble product obtained by first reacting an aliphatic hydrocarbon-substituted succinic acid or derivative thereof which is capable of forming carboximide bonds with an alkylene polyamine to form a carboximide and then reacting said carboximide with an alkylaryl sulfonic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

Wax-flux composition containing a succinimide salt of an alkylaryl

An electrical discharge machining process using as a dielectric fluid a composition comprising a base oil and a minor amount of an oil-soluble cationic organic surfactant.

Electrical discharge machining process with fluid containing a cationic

Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble alkylaryl sulfonic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the component leads, and (D) soldering the components to the printed circuit board.

Wax-flux composition containing alkylaryl sulfonic acid for soldering

Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble diester of sulfomalic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

Wax-flux composition containing a diester of sulfomalic acid for

Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble diester of sulfomaleic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

Wax-flux composition containing a diester of sulfomaleic acid for

Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble amine salt of an alpha-bromo aliphatic carboxylic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

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Lafayette, CA, United States of America

Robert A Stayner