The Boeing Company

Motorola Corporation

Theboeing Company

Robert A Nowak

Eric W Walliser

James L Melquist

John Vernon Alexander

Michael R McNiece

Rick Bomber

A hub fairing system () for a stopped-rotor aircraft () having a fuselage () including a hub (). The hub () is mechanically coupled to the fuselage () and to multiple blades () and is rotated by an engine (). A retractable fairing () covers a portion of the hub (). An actuator () is coupled to the fairing (). A controller () is coupled to the actuator () and retracts the fairing (). A method of reducing drag on the aircraft includes transitioning between a rotary-wing mode and a fixed-wing mode. The fairing () is deployed over a portion of the hub () upon the completion of the transition between flight modes.

Rotor/wing dual mode hub fairing system

An optical fiber connector has a center component provided with opposite first and second ends into which first and second connector inserts holding ends of respective optical fiber bundles are to be inserted, an optical core element mounted in the center component having opposite ends against which the ends of the respective optical fiber bundles in the first and second connector inserts are to be abutted in alignment, and fastener elements provided with the first and second ends for securely holding the first and second connector inserts in abutting contact with the respective opposite ends of the optical core element.

All-plastic optical mini-connector

A hybrid circuit including IC chips and discrete components wherein a substrate is connected to a lead frame and the lead frame is utilized for securing and positioning the substrate during the mounting and electrical connecting of IC chips and discrete components thereon. Once the entire circuit is connected the lead frame is utilized for securing and positioning the substrate in a transfer mold to encapsulate the substrate with epoxy or the like. In the present invention a pair of matching substrates having interconnected circuits thereon are constructed simultaneously and formed into two interconnected packages which can be tested before or after mounting in a receiving structure. Further, repairs may be made to the final assembly without destruction thereof, since the 'component like' circuit package can be replaced without affecting other parts in the system.

Encapsulated hybrid circuit assembly

Process of manufacturing a encapsulated hybrid circuit assembly

Growing community of inventors

Mesa, AZ, United States of America

Robert A Nowak