The Dow Chemical Company

Dow Global Technolgoies LLC

Robert A Kirchhoff

Kenneth J Bruza

Stephen F Hahn

Alan K Schrock

Jo Ann Gilpin

Kenneth L Foster

Jason Q Niu

R Garth Pews

Kyung W Suh

Jerry E White

John Bernard Horstman

Selim Yalvac

David J Brennan

Richard Allen Lundgard

Kevin E Howard

Daniel D Imeokparia

Glenn A Eisman

Ralph D Priester, Jr

Michael O Myers

James J Jakubowski

P J Thomas

James E Pate, Iii

Yohannes Chonde

Yongfu Li

Daniel M Scheck

Charles Z Hotz

Lana S Spencer

Werner A Lidy

Youngfu Li

Brian M Banker

Matthew R Kesterson

Cynthia Baker

James E Iii Pate

Ralph D Priester

A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene.

Sacrificial benzocyclobutene/norbornene polymers for making air gap semiconductor devices

A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is a copolymer of bis[3-(4-benzocyclobutenyl)]1,n (n=2-12) alkyldiol diacrylate (such as bis[3-(4-benzocyclobutenyl)]1,6 hexanediol diacrylate) and 1,3 bis 2[4-benzocyclobutenyl(ethenyl)]benzene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is a copolymer of bis[3-(4-benzocyclobutenyl)]1,n (n=2-12)alkyldiol diacrylate and 1,3 bis 2[4-benzocyclobutenyl(ethenyl)]benzene.

Sacrificial benzocyclobutene copolymers for making air gap semiconductor devices

Prepare a multimodal thermoplastic polymer foam having a distribution of large and small cells in a substantial absence of water by using a blowing agent stabilizer. Multimodal foams of the present invention have blowing agent stabilizer predominantly located proximate to large cells. The resulting multimodal foams have particular utility as thermal insulating materials.

Water-free preparation process for multimodal thermoplastic polymer foam and foam therefrom

The present invention provides a process for preparing a stable dispersion of a preformed polymer in a polyol in a single mixer. A preformed polymer is mixed under sufficient heat and shear to reduce its particle size to a desired size in the presence of a polyol. The present invention also provides stable dispersions of polymers in polyols and polyurethane formulations containing stable dispersions made by the process of the present invention.

Dispersion of a preformed polymer in a polyol

The invention is a process for the preparation of coated nitride powder, comprising contacting one or more metal complex(es), organo-aluminum material, optionally one or more silicon compounds or mixtures thereof, with nitride powder under conditions such that coated nitride powder is formed. A metal complex is a metal-containing system which is soluble in a host liquid. The process of the invention is a process for making coated nitride powder and obtaining the desirable properties of coated nitride powder, while maintaining the desirable properties of the uncoated powder, such as good thermal conductivity, for use in electronic applications. In another aspect, the invention is a coated nitride powder which has the advantageous properties of the uncoated powder and is a desirable alternative to current nitride coatings.

Method of preparing coated nitride powder and the coated powder produced

A compound having at least one 2-hydroxy-1,3-propylidene, 2-acetoxy-1,3-propylidene, or 2-alkoxy-1,3-propylidene moiety between two benzocyclobutene end moieties is prepared by (a) contacting a diepoxide species with a benzocyclobutene species containing a functionality capable of reacting with an epoxy group, (b) contacting an epoxy-containing benzocyclobutene species with a species containing two functionalities capable of reacting with an epoxy group, (c) contacting an epoxy-containing benzocyclobutene species with a benzocyclobutene species containing a functionality capable of reacting with an epoxy group, (d) contacting epichlorohydrin with benzocyclobutene species capable of reacting with an epoxy group, or (e) contacting epihalohydrin with benzocyclobutene species and difunctional species, wherein both species contain functionalities capable of reacting with epoxy groups. Each benzocyclobutene moiety is attached to the 2-hydroxy-1,3-propylidene moiety at the six-membered ring through oxygen or sulfur atoms, carboxyl, N-alkylimino, or 1,3-dioxyphenylene units. The unit linking the two benzocyclobutene moieties optionally contains aromatic moieties. The polymers prepared from the compounds are suitable for use in composites, coatings, adhesives, and binders. The polymers have outstanding processability and are mainly non-crystalline materials with low melt viscosities prior to the onset of curing.

Bisbenzocyclobutene thermosetting compounds and process for preparing

The invention is a bis-BCB compound of the structure: ##STR1## a method for making same and polymers made therefrom. The novel compounds of this invention are useful in preparing polymers that can form thin film coatings for multichip midules (MCMs) and integrated circuits (ICs). These compounds can be isolated as liquids at room temperature, and can form polymers that are hydrophobic and have low dielectrical and dissipative properties.

Bisbenzocyclobutene compounds with hydrophobic substituents, a method

The invention is a poly(arylcyclobutene) comprising arylcyclobutene moieties connected by a bridging member, wherein the bridging member is (a) a direct bond, (b) a polyvalent inorganic radical or (c) a polyvalent organic radical which contains (1) one or more heteroatoms comprising oxygen, sulfur, nitrogen or phosphorus or (2) one or more aromatic radicals, and wherein one or more cyclobutene rings are fused to one of the aryl rings.

Poly(arylcyclobutenes)

This invention is directed to a class of arylcyclobutene monomers having the general formula: ##STR1## wherein Ar is aromatic, with the proviso that the carbons of the cyclobutene rings are bonded to adjacent carbon atoms on the same aromatic ring of Ar;

Liquid bisarylcyclobutene monomers and polymers

Copolymers of a mono(cyclobutarene) comonomer and a polymaleimide comonomer are described. These copolymers have higher thermal stability and lower water absorption than polymaleimide homopolymers. They are useful in applications such as electronics, membranes, composities, coatings, and adhesives. Examples of such copolymers are those formed from the comonomers 1,1'-(methylenedi-4,1-phenylene)bismaleimide, and 3-(1-(4-methylphenyl)ethenyl)-bicyclo(4.2.0)octa-1,3,5-triene or 3-(2-(4-methylphenyl)ethenyl)-bicyclo(4.2.0)octa-1,3,5-triene.

Mono(cyclobutarene)/polymaleimide copolymers

A biscyclobutarene monomer is prepared having two cyclobutarene moieties bridged by a divalent radical having at least one azo linkage. The monomers can be polymerized to form polymers exhibiting outstanding thermooxidative stability at high temperatures for prolonged time periods.

Monomers of biscyclobutarenes bridged by at least one azo linkage

Copolymers comprising, in polymerized form, a 1,1-substituted arylethylene comonomer and at least one polymaleimide comonomer, are prepared using a system that provides a reduced onset of polymerization temperature thereby allowing removal of the copolymer from the mold after a preliminary curing period followed by transfer to an oven, a less expensive piece of equipment, for additional curing; thus making the mold, a more expensive piece of equipment, available for the next polymerization run.

1,1-substituted arylethylenes/polymaleimide copolymers

The invention is a poly(arylcyclobutene) comprising arylcyclobutene moieties connected by a bridging member, wherein the bridging member comprises an amidoalkyl termintated polysiloxane, and wherein one or more cyclobutene rings are fused to one of the aryl rings.

Novel poly(arylcyclobutenes)

The invention is a poly(arylcyclobutene) comprising arylcyclobutene moieties connected by a bridging member, which comprises a polyvalent organic radical which comprises carbonyloxy moieties which are bound to each aryl moiety, and a hydrocarbon poly-yl optionally containing N, O, S or P, wherein each carbonyloxy moiety is bound to such poly-yl, and wherein one or more cyclobutene rings are fused to one of the aryl rings.

The invention is a compound which comprises an unsaturated cyclic imide moiety and an aryl cyclobutene moiety, wherein the cyclobutene moiety is fused to the aryl radical, and wherein the imide nitrogen is connected to the aryl radical by a direct bond or a bridging member. Another aspect of this invention is a polyimide polymeric composition which results from the polymerization of the above-described compounds.

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Midland, MI, United States of America

Robert A Kirchhoff