Rca Inc.

Robert A Dwyer

James E Gillberg

Russell G Ott

A three part edge seal for an integrated circuit semiconductor chip is disclosed. The edge seal includes two separate layers of metal one of which overlays the other in electrical contact. One of the metal layers is in ohmic contact with a highly doped region formed in the planar surface of the semiconductor body. The two metal layers serve as an electrical conductor to distribute power to various portions of the integrated circuit contained in the chip and electrically charge the highly doped region to prevent migration of ions into the active areas of the integrated circuits.

Double level metal edge seal for a semiconductor device

A universal interface adaptor circuit (UIAC) for connecting any one of a plurality of either of two general microprocessor types to a peripheral device using the same interface connections to selectively generate and supply either a WRITE ENABLE signal or a READ ENABLE signal to a peripheral device. A first of the two general types of microprocessors is used in multiplexed-bus multiprocessor (MBM) systems and the second of the two general types of microprocessors is used in non-multiplexed-bus microprocessor (NMBM) systems, where the microprocessors used in both the MBM and the NMBM systems each supply three output signals for determining whether the function is a READ or a WRITE function and the time of occurrence of such READ or WRITE function. The UIAC comprises logic array having three input terminals X, Y, and Z for receiving the three output signals from each of the microprocessors employed in either the MBM systems or the NMBM systems. First selected logic elements of the logic array respond to the three output signals received from the MBM type systems to produce a READ ENABLE signal when the signals thereon indicate a READ function and a WRITE ENABLE signal when the signals thereon indicate a WRITE function, and second selected logic elements of the logic array respond to the three output signals received from the NMBM type systems to produce a READ ENABLE signal when the signals thereon indicate a READ function, and to produce a WRITE ENABLE signal when the signals thereon indicate a WRITE function.

Universal interface circuit for microprocessor peripherals

A bond region is provided on an integrated circuit chip wherein the bond region has two or more sets of closely spaced conductors, each of which is electrically connected to a different point of the integrated circuit. During the manufacturing of the device, at the time of assembly of the chip into the package one end of a connector wire may, optionally, be bonded to the bond region thereby effecting a multiple connection of these different points of the integrated circuit. Such a procedure will enable a specific mode of operation of a multi-mode device.

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Readington Township, NJ, United States of America

Robert A Dwyer