Gte Laboratories Incorporated

The Whitaker Corporation

Gte Products Corporation

Boudreau, Robert A.

Wilkie, Robert J.

Robert A Boudreau

Hongtao Han

John R Rowlette, Sr

William C Rideout

Terry P Bowen

Jared D Stack

Paul O Haugsjaa

Joanne Snare LaCourse

Michael J Urban

Robert J Wilkie

Michael Aaron Kadar-Kallen

Cheng-Chung Li

Randall Brian Wilson

Robert Wallace Roff

Paul R Reitz

Hatem Abdelkader

Ping Zhou

Robert E Brown

Richard H Sargent

Fan Qian

Ervin H Mueller

Narinder Kapany

According to the present invention, an optical waveguide is provided on a silica or silicon substrate using MPACVD and ICP etching processes. Optical fiber is coupled to the waveguide by positioning the fiber in a groove formed in the waveguide and compressing a top lid on the fiber. The top lid is secured to the waveguide and fiber by an epoxy or a solder. In a solder based embodiment, the cladding of the fiber may have a metallization evaporated thereon.

Planar waveguide devices and fiber attachment

The present invention involves a combination of active and passive optical or opto-electronic device alignment techniques. Passive alignment is used for two axial lateral directions and all three axial rotational directions (yaw, pitch and roll). In such passive alignment, only the substrate is micromachined with passive alignment structures. One-dimensional active alignment is then used for the remaining axial lateral direction.

One-dimensional active alignment of optical or opto-electronic devices

An optical subassembly for monitoring the emission of a semi-conductor laser is disclosed. The subassembly is diced from a wafer having mounted thereon the devices to be tested as well as the testing optical devices. The devices of the wafer are burned-in and those sections of the wafer having lasers that pass the burn-in testing are diced and form the subassemblies of the present invention.

Monitor-detector assembly on silicon wafer board

The present invention relates to a novel, accurate, passive alignment of optical and optoelectronic elements using silicon waferboard technology. The invention particularly relates to the use of etched v-grooves on monocrystalline materials in conjunction with alignment spheres to effect the passive alignment.

Kinematic mounting of optical and optoelectronic elements on silicon

A planar hybrid optical amplifier is fabricated on a single crystal substrate. The components that are common to a variety of optical amplifier circuits are mounted on the substrate and the planar device that results is readily interchanged in various applications. In one embodiment the multiplexed signal consisting of light from a pump laser and an optical signal are introduced into a rare earth doped fiber which amplifies the input signal through stimulated emission of radiation.

Planar hybrid optical amplifier

A dielectric substrate of a material such as silicon is used to provide controlled impedance waveguides for coupling an optoelectronic device to an electronic device. The impedance is controlled by varying the thickness of the dielectric between the signal lines and the ground plane. In the preferred embodiment, the crystallographic structure of the silicon is employed to achieve great precision of the dielectric thickness.

Controlled impedance lines connected to optoelectronic devices

A passively aligned optical interconnect is described for use as a wavelength division multiplexer (WDM) and demultiplexer. The device makes use of silicon waferboard for a low cost interconnect. Computer generated holograms are used to effect the multiplexing/demultiplexing as well as focusing of the beams. In an alternative embodiment, the device is used as a beam splitter for monochromatic light. In yet another embodiment, the device is used to spatially separate the polarization states of light.

Passively aligned holographic WDM

A passively aligned bi-directional optoelectronic transceiver module assembly utilizes a computer generated hologram as a diffractor to split/combine light beams of two different wavelengths. The entire assembly is constructed of monocrystalline silicon which is photolithographically batch processed to provide a low cost, compact structure with precision tolerances which is inherently passively aligned upon assembly.

Passively aligned bi-directional optoelectronic transceiver module

A solder geometry for epi-down diebonding an optoelectronic component to a heat sink platform includes a solder deposition pattern having exposure windows to create gaps or diebond bridges in the solder pattern. The active regions of the components are disposably registered within the gaps of the solder pattern.

Diebonding geometry for packaging optoelectronics

The disclosure describes an optical interconnect which utilizes a silicon waferboard (1) with grooves (3,4) etched to expose preferred crystallographic planes to effect alignment of focusing elements (5) between optical waveguides (6) and optoelectronic devices (2). The focusing elements (5) are made of silicon wafers and are etched to expose crystal planes which compliment crystal planes of cavities or grooves which are etched in the waferboard. The focusing elements may have holograms (7) formed thereon for efficient focusing to the optical waveguide (6).

Optoelectronic integration of holograms using (110) oriented silicon on

An opto-electronic interconnect is disclosed that provides for optical communication between chip devices. Optical signals, transmitted from one of the edges of a first chip device, are directed by a lens focusing apparatus to the edge of a second chip device, whereupon the signal is detected. The optical ports for transmission or reception of the optical signals are grouped into an optical segment, which may have either a semi-circular or planar geometry.

Optical multi-chip interconnect

A method of compensating for the angular coupling of optical fibers to a tilted facet optoelectronic component involves a precise calculation of the coupling angle with respect to the active layer of the component and with respect to the side walls of the package in which the component is to be mounted. With these angles computed, the tilted facet component is positioned on a carrier at an offset to the perpendicular such that input/output fibers can exit the component package perpendicularly to its sidewalls. The component is secured to the carrier by a solder having a high melting point such that subsequent soldering of parts to the carrier will not affect the component positioning. A localized cooling method then allows the sequential alignment and soldering of one optical fiber at a time to the offset tilted facet component, while previously aligned and soldered optical fibers are held fixed. This method utilizes the mechanical property of a sharp melting point eutectic alloy solder or a pure metal solder for the fiber connections and is effective for multi-fiber optoelectronic packages demanding stability and high precision. A package design for tilted facet optoelectronic components requiring multi-fiber alignment incorporates this feature of localized cooling internally. The package utilizing localized cooling method internally eliminates the tilted facet-optical fiber alignment problem, while providing standard lead configurations.

Multi-fiber alignment package for tilted facet optoelectronic components

A method for optically coupling multiple single-mode optical fibers to a single packaged optoelectronic array device uses a single graded index lens to magnify the images of the active semi-conductor elements and to expand the spacing between their light beams. These separated magnified light beams then coupled to an associated array of uptapered optical fibers. Simultaneous alignment is possible because the location of the semiconductor array beams can be known with high precision relative to the central beam in the array. A lens with known magnification is first positioned relative to the central beam. Alignment to this central beam automatically aligns other optical fibers held collectively in a fixture engineered with the geometry set by the known magnification of the lens. The coupling of single-mode optical fiber to two-dimensional semiconductor surface arrays utilizes the projected and magnified beams of the array which replicate the precise placement of the array elements. A mandrel supports the uptapered optical fibers. Simultaneous alignment of the optical fiber array is performed by first aligning the center fiber, and then rotating the mandrel until the outside fibers come into alignment.

Method of aligning and packaging an optoelectronic component with a

A method of optically coupling an optoelectronic device having a photoactive element to an uptapered single-mode optical fiber which connects said optoelectronic device to an external device includes securing a graded index lens to a substrate carrier within a housing at a distance calculated to provide a known magnification of a light beam emanating from said element, and further includes mechanically positioning and actively aligning the fiber to said magnified light beam to achieve optimal optical coupling to said optoelectronic device. The location of a plurality of reference marks and surfaces are determined such that the photoactive element, the lens and the uptapered end of the single-mode optical fiber may be positioned with respect to these references for precise optical coupling using an active alignment for final adjustments. The reference surfaces include a pedestal for the laser and a plurality of stops for the lens integrally formed with the substrate. The method also includes mechanically positioning the uptapered fiber within a fiber tube which is removably secured to a flange. The precisely calculated alignment based on the spacing of said photoactive element, the magnification of said lens, and the fiber positioning is achieved by mechanical means.

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Hummelstown, PA, United States of America

Robert A Boudreau