Shipley Company LLC

Robert A Binstead

Eugene N Step

Jeffrey M Calvert

Wade W Sonnenberg

Mark J Kapeckas

Leon Barstad

Denis Morrissey

Robert D Mikkola

David A Valeri

David L Jacques

Raymond Cruz

Osnat Younes-Metzler

Elie H Najjar

A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor; an electrolyte disposed within the sheath; and an optionally porous element on the sheath, the porous element providing signal communication between the electrolyte and an analyte.

Electrode, electrochemical cell, and method for analysis of electroplating baths

Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.

Plating bath analysis

Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.

Electroplating bath control

Disclosed are compositions and methods for providing a planarized metal layer on a substrate having small apertures. The compositions and methods of the present invention provide complete fill of small apertures with reduced void formation.

Copper electroplating

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Marlborough, MA, United States of America

Robert A Binstead