Intel Corporation

Rob W Sims

Sankaran M Menon

Jorge Pedro Rodriguez

Rolf H Kuehnis

Michael Zack Eckblad

Kannan G Raja

Baomin Liu

Ronald C Flamm

Gopinath Kandasamy

Aurelio Rodriguez Echevarria

Phil R Lehwalder

Stephen P Eastman

Linden H McClure

Sivasankarareddy Juturu

Uppalapati V Ramgopal

Linden H Mcclure

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.

System and method to help mitigate heat in an electronic device

A power supply comprising a hardware interface having conductive contacts and conforming to a power supply design standard comprising a pin-out definition specifying that a first conductive contact is to be dedicated to communicating first information of a first type. The power supply comprises first, second, and third circuitry. The first circuitry is to determine the first information. The second circuitry is to determine second information of a second type, wherein the second type of information is other than the first type. The third circuitry is to send, via the first conductive contact, a communication comprising the first information and the second information. In embodiments, a PCB comprises a connector to couple the PCB to the power supply via an interconnect to be coupled to the hardware interface, and an IC to receive the communication, and identify the first and second information.

Power supply communications via a shared channel for performance management

In one embodiment, an apparatus includes a controller to couple between a system on chip (SoC) and an external connector of a platform. The controller may include: a digitizer to digitize platform telemetry information of the platform; and a control circuit to receive a command from a debug test system and direct the platform telemetry information to a destination in response to the command. Other embodiments are described and claimed.

System, apparatus and method for non-intrusive platform telemetry reporting using an all-in-one connector

An apparatus, and method for using same, is described for a distributed load board stiffener. The apparatus may include a body having a central axis portion and multiple protusions extending away from the central axis portion towards respective ends. Each of the ends of the protrusions having a mounting point to mount a printed circuit board to a chassis support. The protrusions may operate to mount the board stiffener to a printed circuit board away from trace routing areas disposed centrally on the printed circuit board. The protrusions may operate to distribute a load around a periphery of the printed circuit board.

Distributed load board stiffener

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Forest Grove, OR, United States of America

Rob W Sims