Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno

Ncc Nano, LLC

Pulseforge Incorporated

Rob Jacob Hendriks

Kurt Anthony Schroder

Edsger Constant Pieter Smits

Charles C Munson

Sandeep Unnikrishnan

Gari Arutinov

Robin Bernardus Johannes Koldeweij

Fabien Bernard Jacques Bruning

Sandeep Menon Perinchery

Pim Groen

Md Tahmid Hossain

Daan Anton Van Den Ende

A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

Transferring viscous materials

A method of depositing a donor material onto a target surface is provided herein, in which a first main side of a substrate is covered with a stretchable layer that is attaching thereto with a sealing around an enclosed area at the first main side, therewith defining an enclosure. The stretchable layer has an outer surface that faces away from the substrate, and that is patterned with one or more recessed areas filled with the donor material to be deposited. A relatively high pressure is provided in an interior of the enclosure so that its volume is increased and the patterned surface of the stretchable layer is pressed against the target surface. In that state of the stretchable layer the substrate is irradiated at a second main side opposite its first main side with photon radiation that has an intensity and a duration that causes a transfer of donor material from the one or more recessed areas to the target surface. Also a plate and a deposition device are provided.

Controlled deposition method of a donor material onto a target surface and plate therefor

The present disclosure pertains to a deposition system, a method and use of such system for filling a groove provided into surface of a workpiece with a printable medium, in particular a highly viscous paste. The system includes a deposition head that includes a first deposition chamber that extends to a first orifice. The orifice is reversibly closed off between at least two shutter elements. In some embodiments the system is a dual chamber system, each chamber having a reversible closable orifice. The system is arranged to maintain a flush physical relationship between the workpiece and the terminal ends of the shutter elements, so as to, upon application of a working pressure, fill the groove.

Device and method of filling grooves

A method and system for light induced transfer of components from a donor substrate to an acceptor substrate are described. The donor substrate includes a transparent carrier configured to carry the components facing the acceptor substrate, and a release stack. The release stack includes a light-absorbing layer, a melt layer, and an adhesive layer. The light-absorbing layer has a relatively high absorption coefficient for absorbing the light beam causing heat which is conducted to the melt layer. The light-absorbing layer has a relatively high melting temperature such that the light-absorbing layer can remain solid while the melt layer is melted. The adhesive layer adheres the components to the melt layer while the melt layer is solid and releases adhesion when the melt layer is melted.

Multi-layer release stack for light induced transfer of components

A plate including functional material to be deposited onto a target surface using monochromatic radiation having a wavelength is described. The plate further includes a substrate with a first surface directed towards the target surface and with a second surface to receive the monochromatic radiation. The first surface is patterned with recessed areas that have a dielectric coating and that are filled with the functional material. The dielectric coating includes a sequence of dielectric coating layers alternating in refractive index. The dielectric coating therewith has a relatively high reflectivity for said monochromatic radiation incident perpendicular to the dielectric coating in comparison to a reflectivity for said monochromatic radiation incident at an angle of 45 degrees to the dielectric coating. As such shear forces are mitigated without requiring a high alignment accuracy. The present application further describes a deposition device including the plate and a method involving the plate.

Controlled deposition of a functional material onto a target surface

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

Method for curing solder paste on a thermally fragile substrate

A method and apparatus for delaminating a polymer film from a carrier plate is disclosed. The carrier plate is at least partially transparent and has deposited on it a pixelated pattern layer of light-absorptive material, upon which is deposited a layer of light-reflective material. A polymer film, which is to be delaminated, is deposited on the light-reflecting material layer. Next, a pulsed light source is utilized to irradiate through the carrier plate from the side opposite the polymer film to heat the light-absorptive material layer. The heated areas of the light-absorptive material layer, in turn, heat the polymer film through conduction at the interface between the light-absorptive material layer and the polymer film, thereby generating gas from the polymer film by its thermal decomposition, which allows the polymer film to be released from the carrier plate.

Method for performing delamination of a polymer film

A method for depositing a functional material on a substrate is disclosed. An optically transparent plate having a first surface and a second surface with one or more wells is provided. After coating the second surface with a thin layer of light-absorbing material, the wells are filled with a functional material. The plate is then irradiated with a pulsed light to heat the layer of light-absorbing material in order to generate gas at an interface between the layer of light-absorbing material and the functional material to release the functional material from the wells onto a receiving substrate located adjacent to the plate.

Method for depositing a functional material on a substrate

A method for depositing a functional material on a substrate is disclosed. A plate having a first surface and a second surface is provided. A layer of light scattering material is applied onto the first surface of the plate, and a layer of reflective material is applied onto the second surface of the plate. After a group of wells has been formed on the second surface of the plate, a layer of light-absorbing material is applied on the second surface of the plate. Next, the wells are partially filled with a functional material. The plate is then irradiated with a pulse of light to heat the light-absorbing material between the bottom of the well and the functional material. This heats the gas in the ullage between the light absorbing material and the functional material to increase the pressure in gas to expel the functional material from the wells onto a receiving substrate.

Method for deposting a functional material on a substrate

The present disclosure concerns an electrical circuit pattern on a substrate, as well as a method and system for forming same. In a typical embodiment, a light pattern is projected through a transparent layer to cause a patterned release of adhesion between a continuous material layer and the transparent layer. A release layer adhered to the patterned material layer is pulled off the substrate to separate the material having lower adhesion while leaving the material that was not exposed to form the electrical circuit pattern thereon.

Substrate comprising an electrical circuit pattern, method and system for providing same

The present disclosure concerns a method and system for providing a patterned structure () on an acceptor substrate). The method comprises providing a donor substrate () arranged between a light source () and an acceptor substrate (). A mask () is arranged between the light source () and the donor substrate (). The mask () comprises a mask pattern () for patterning light (). The patterned light () impinging the donor substrate () causes the donor material () to be released from the donor substrate () and transfer to the acceptor substrate () to form the patterned structure () thereon. The patterned light () is divided by the mask pattern () into a plurality of separate homogeneously sized beams () simultaneously impinging the donor substrate () for causing the donor material () to be released from the donor substrate () in the form of separate homogeneously sized droplets ().

Method and system for forming a patterned structure on a substrate

A method and apparatus for soldering a chip () to a substrate (). A chip carrier () is provided between a flash lamp () and the substrate (). The chip () is attached to the chip carrier () on a side of the chip carrier () facing the substrate (). A solder material () is disposed between the chip () and the substrate (). The flash lamp () generates a light pulse () for heating the chip (). The heating of the chip () causes the chip () to be released from the chip carrier () towards the substrate (). The solder material () is at least partially melted by contact with the heated chip () for attaching the chip () to the substrate ().

Apparatus and method for contactless transfer and soldering of chips using a flash lamp

A system and method for manufacturing a micropillar array (). A carrier () is provided with a layer of metal ink (). A high energy light source () irradiates the metal ink () via a mask () between the carrier () and the light source. The mask is configured to pass a cross-section illuminated image of the micropillar array onto the metal ink (), thereby causing a patterned sintering of the metal ink () to form a first subsection layer () of the micropillar array () in the layer of metal ink (). A further layer of the metal ink () is applied on top of the first subsection layer () of the micropillar array () and irradiated via the mask () to form a second subsection layer () of the micropillar array on top. The process is repeated to achieve high aspect ratio micropillars

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Eindhoven, Netherlands

Rob Jacob Hendriks