Asml Netherlands B.v.

Rizvi Rahman

Hakki Ergün Cekli

Elliott Gerard McNamara

Emil Peter Schmitt-Weaver

Michiel Kupers

Willem Seine Christian Roelofs

Erik Henri Adriaan Delvigne

Masashi Ishibashi

Wendy Johanna Martina Van De Ven

Cëdric Dësirë Grouwstra

Measurements are obtained from locations across a substrate before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of a performance parameter such as overlay, after a pattern has been applied. A set of measurement locations is selected from among all possible measurement locations. At least a subset of the selected measurement locations are selected dynamically, in response to measurements obtained using a preliminary selection of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect, outlier measurements are detected based on supplementary data such as height measurements or historic data.

Method of obtaining measurements, apparatus for performing a process step, and metrology apparatus

A device manufacturing method, the method including: obtaining a measurement data time series of a plurality of substrates on which an exposure step and a process step have been performed; obtaining a status data time series relating to conditions prevailing when the process step was performed on at least some of the plurality of substrates; applying a filter to the measurement data time series and the status data time series to obtain filtered data; and determining, using the filtered data, a correction to be applied in an exposure step performed on a subsequent substrate.

Device manufacturing methods

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Bundang-gu, South Korea

Rizvi Rahman