Honeywell International Inc.

Ritu Rai

Deepak Kumar

Prashant Deshpande

Pranita Madke

Sridhar Vanka

Prashantha Sv

A device includes a processor or integrated circuit package and at least one MEMS device coupled to the processor or integrated circuit package. The at least one MEMS device includes a first arm, a second arm, at least one permanent magnet, a fan structure, and a coil. The second arm is coupled to, and is spaced apart from, the first arm. The at least one permanent magnet is coupled to the first arm. The fan structure is coupled to, and extends in cantilever manner from, the second arm. The coil is disposed on or within the fan. Thus, when the coil is electrically energized, a Lorentz force is generated that causes the fan structure to vibrate relative to the at least one permanent magnet and relative to the processor, to thereby cool the processor or integrated circuit package.

Processors and integrated circuits including a microelectromechanical systems (MEMS) device for cooling

A microelectromechanical systems (MEMS) device and a light assembly that includes the MEMS device. The MEMS device includes a first arm, a second arm, at least one permanent magnet, a fan structure, and a coil. The first arm has a first arm first end and a first arm second end. The second arm is coupled to, and is spaced apart from, the first arm and has a second arm first end and a second arm second end. The at least one permanent magnet is coupled to the first arm second end. The fan structure is coupled to, and extends in cantilever manner from, the second arm second end and includes a connection end and a free end. The coil is disposed on or within the fan structure. When the coil is electrically energized, a Lorentz force is generated that causes the fan structure to vibrate relative to the permanent magnet.

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Bengaluru, India

Ritu Rai