Intel Corporation

Ritu Bawa

Prakash Kurma Raju

Kathiravan D

Mark Charles Carbone

Juha Paavola

Vivek Paranjape

Prasanna Pichumani

Gustavo Fricke

Christopher M Moore

Hari Shanker Thakur

Triplicane Gopikrishnan Babu

Jeff Ku

Daniel J Ragland

Gavin Sung

Arnab Sen

Bijendra Singh

Samarth Alva

Justin Michael Huttula

Hua Yang

Mikko Antero Makinen

Kannan G Raja

Gokul V Subramaniam

Lance Lin

Jason Y Jiang

Baomin Liu

Xiyong Tian

Ruander Cardenas

Jia Yan Go

Raghavendra Doddi

Twan Sing Loo

Columbia Mishra

Evan Piotr Kuklinski

Gerry Juan

Chin Kung Goh

Javed Shaikh

Nehakausar Shaikh Ramjan Pinjari

Doddi Raghavendra

Chun-Ting Liu

Shih Wei Nien

Sudheera Sudhakar

George Baoci Sun

Bhavaneeswaran Anbalagan

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

Arunpandi R

Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.

Thermal management systems for electronic devices and related methods

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

Hinge assembly and guide assembly for electronic devices using a heat carrying member

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

Vapor chamber and means of attachment

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Bengaluru, India

Ritu Bawa