Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Ritsuji Toba

Kanji Murakami

Haruo Akahoshi

Mineo Kawamoto

Motoyo Wajima

Nobuyuki Hayashi

Toshikazu Narahara

Toshiaki Ishimaru

Takeshi Shimazaki

Toyofusa Yoshimura

Kiyonori Kogawa

Nobuaki Ooki

Akio Tadokoro

Satoshi Yoshitomi

Akio Takokoro

Yuuzi Takada

Tsunehumi Mutoo

In conducting wiring by masking the portion other than the portion to be wired of a metallic laminate with a photoresist for plating and subjecting only the portion to be wired to pattern plating, the provision of a noble metal layer made of gold, platinum or the like, or a metallic layer made of a metal having a larger ionization tendency than that of a metal used in the pattern plating on the metallic layer constituting the undercoat of the photoresist for plating enables the peeling of the resist for plating to be prevented and excellent fine wiring to be conducted.

Method for improving adhesion of a resist layer to a metallic layer and

A method for treating the interior surfaces of holes as well as the surfaces of a perforated workpiece by dipping it into treating liquid includes a step of causing treating liquid to flow at both ends of the holes in a direction perpendicular to these holes at different velocities. In order to create these liquid flows at different velocities, the workpiece is dipped in the liquid so that the holes extend substantially horizontally, and air bubble jets are alternately delivered along both ends of the holes, or fins are provided at locations adjacent both ends of the holes so as to extend outwardly upwardly at one side of the hole ends and extend outwardly downwardly at the other side of the hole ends, and these fins are moved upwardly and downwardly.

Method for treating interior surfaces of holes and apparatus therefor

The present invention provide a process for producing printed circuit boards which comprises the steps of

Process for producing printed circuit board

An electroless copper plating process for producing fine patterned wiring boards is improved by supplying very fine oxygen-containing gas bubbles through a porous alkali-resistant resin gas dispersing tube. An electroless copper plating apparatus having such a gas dispersing tube is also provided.

Process for electroless copper plating and apparatus used therefor

A pretreatment process for removing air within through-holes of printed circuit boards before plating the through-holes is provided. Air within the through-holes of the printed circuit boards is replaced with a saturated vapor of a water-soluble liquid by dipping the printed circuit board into the boiled liquid and then the saturated vapor is dissolved in water or a water-soluble liquid to remove air.

Process for pretreatment before plating through-holes of printed circuit

A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.

Method of bonding copper and resin

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Hadano, Japan

Ritsuji Toba