Applied Materials, Inc.

Rionard Purnawan

Young Seen Lee

Zhong Qiang Hua

Hemant P Mungekar

Sanjay G Kamath

Walter Zygmunt

Agnieszka Jakubowicz

The present invention pertains to methods of depositing low stress/high index multi-layer films on a substrate using an HDP-CVD process. The multi-layer films include two lining layers and a bulk gap-fill layer and the HDP-CVD process employs a reduced substrate bias power during deposition of at least the second lining layer. Deposition of the three layers occurs at reduced deposition temperatures which further reduces the stress of the multi-layer film. The lower stress results in less defectivity which improves the films ability to maintain optical confinement of radiation.

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Mountain View, CA, United States of America

Rionard Purnawan