Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Other

Rintaro Minamitani

Shigeo Ohashi

Takashi Naganawa

Yoshihiro Kondo

Tsuyoshi Nakagawa

Yuji Yoshitomi

Shinji Matsushita

Makoto Kitano

Noriyuki Ashiwake

Masato Nakanishi

Osamu Suzuki

Akio Yasukawa

Keiji Hanzawa

Hajime Katou

Yuuji Yoshitomi

Yasuhiko Sasaki

Shizuhisa Watanabe

Yasunori Yamada

Masamichi Yamada

Shinya Igarashi

Hitoshi Matsushima

Takao Miwa

Norio Ishitsuka

Akira Koide

Atsuo Nishihara

Masahiro Komachiya

Yasushi Neho

Hironori Oikawa

Kenichi Saitou

Shuichi Terakado

Tatsunori Sakaguchi

Daichi Hotta

Takayuki Fumino

Yuichi Kondo

An object of the present invention is to provide a corrosive environment monitoring apparatus and a corrosive environment monitoring method for evaluating the corrosiveness of an ambient environment simply and accurately in a short time period. The corrosive environment monitoring apparatus () of this invention has at least one vent duct () in which specimens () are installed so that the corrosiveness of the ambient environment is measured from the corroded conditions of the specimens (). The regions of the specimens () in one vent duct (), which are subject to measurement, are made of the same metallic material. If a plurality of vent ducts () are provided, these vent ducts () are arranged in parallel with one another.

Corrosive environment monitoring apparatus and method

An object of the present invention is to provide a thermal airflow sensor that prevents moisture absorption by a silicon oxide film formed closest to a surface (formed to be located on an uppermost portion), and that reduces a measuring error. In order to attain the foregoing object, the thermal airflow sensor according to the present invention applies an ion implantation to a silicon oxide film, formed closest to a surface (formed to be located on an uppermost portion), by using an atom or molecule selected from at least any one of silicon, oxygen, and an inert element such as argon or nitrogen, in order to increase a concentration of an atom contained in the silicon oxide filmmore than that before the ion implantation.

Thermal airlflow sensor

A measurement element includes a semiconductor substrate with electrical insulating film formed thereon. A resistor formed on the electrical insulating film constitutes a heater; and a cavity is formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in the thickness direction. The measurement element has a film formed covering the region of the opening or slit.

Thermal humidity sensor

In a structure in which peripheral part of a diaphragm section of an electrical insulating film is covered with a protective film made of an organic material, the resistor wire on the diaphragm section crosses the peripheral part of the diaphragm section. At a place where a narrow wire of a resistance temperature detector and the like crosses the peripheral part of the diaphragm section, the protective film is thinner than the other part, and the dust impact resistance is reduced. At a place where a heating resistor wire connected to a heating resistor body or resistance temperature detector wires connected to resistance temperature detector bodies cross a periphery of the diaphragm section, a film component protruding from an electrical insulating film is arranged side by side with the heating resistor wire or the resistance temperature detector wires.

Air flow meter

In a liquid cooling system, comprising: a heat-receiving jacket for receiving heat from a heat-generation body therein; a heat-radiator for radiating the heat therefrom, which is received within the heat-receiving jacket; and a tank for accumulating refrigerant therein, which is connected with the heat-receiving jacket and the heat-radiator through flow passages, thereby enclosing a refrigerant within the heat-receiving jacket, the heat-radiator and the tank, including the flow passages provided therebetween, and further comprising: a liquid transfer means for generating a circulation flow of the refrigerant enclosed therein, wherein the tank is built up on one side surface of a substrate having superior heat-conductivity and heat-resistance, defined between a flexible film or sheet having superior heat-conductivity and heat-resistance, and the heat-radiator having a heat-radiation flow passage on the other side surface thereof, defined between the flexible film or sheet having superior heat-conductivity and heat-resistance.

Liquid cooling system and an electronic apparatus having the same therein

In an electronic apparatus having a heat-generating element therein, a cooling jacketfor transmitting heat generated from the heat-generating elementinto to a liquid coolant flowing therein, comprises: a coverbuilding up a heat transfer surface to be in contact with a surface of the heat-generating element; a passagefor the liquid coolant, which is formed neighboring with the heat transfer surface and wound round in a 'S'-like manner within an inside of a main bodyof the cooling jacket; and an inletand an outletattached at both ends of the flow passage of the liquid coolant, and further a dispersion memberis disposed in the flow passage, being built up by gathering a plural number of members, each of which has a 'U'-like cross-section of an aspect ratio from 10 to 20, thereby diffusing the liquid coolant therein, so as to transfer the heat from the heat-generating element thereto with high efficiency, and thereby enabling to cool down the heat-generating element, fully, even with a relatively small amount or volume of the liquid coolant.

Cooling jacket

A liquid cooling system is disclosed for use in an electronic apparatus. The system is constructed to be of a reduced size and thickness, thus allowing it to be used for cooling heat-generating devices such as semiconductor elements, while maintaining corrosion resistance. The system includes a pump, a heat-receiving jacket, and flow passages through which the cooling liquid is circulated. An ion exchange bag having a water-permeable bag is disposed within the liquid cooling system. The water-permeable bag further contains an ion exchange resin therein.

Liquid cooling system and electronic apparatus using the same

A liquid cooling system, enabling protection from corrosion due to liquid coolant for a long time-period (5&#x2013;10 years) while cooling a heat-generation body effectively, comprises a pumpa heat-receiving jacketa radiator for radiating heat into an outside, being made up with a heat-radiation pipeand a heat-radiation plateand further a tankfor accumulating the liquid coolantwithin an inside thereof, wherein those are connected in a closed-loop, so as to circulating the cooling liquid therein, thereby cooling the heat-generation of a CPUbeing a heat-generation element, effectively, through the heat-receiving jacketand further a water-permeable bagis disposed in a portion of flow path of the cooling liquid, which receives microcapsulestherein, each enclosing in an inside thereof anti-corrosion agentfor suppressing the corrosion due to the cooling liquid, including such as, a water, etc.

Liquid cooling system and an electronic apparatus applying the same therein

A liquid cooling system, comprises: heat-receiving jacket, thermally connected with a heat-generation element, a pump attached onto a radiator, and a tank portionon the radiator, wherein a coolant liquid is circulated between the heat-receiving jacketand the radiatorby means of the pump, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.

Liquid cooling system

An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.

Electronic equipment

A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.

Liquid cooling system and personal computer using thereof

A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

Liquid cooling system and personal computer using the same

An electronic device capable of preventing air from entering a pump for circulating a cooling medium is provided in a small-sized electronic computer provided with a liquid cooling system, which has a liquid cooling construction for circulating a cooling liquid with the use of a power source and for cooling a high temperature part of with the cooling liquid. The electronic device of the invention comprises a gas entering preventing mechanism provided in a part of a circulating path, through which the cooling liquid circulates, to prevent air from entering the power source.

Electronic device, liquid cooling system and tank

An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.

Electronic apparatus

A liquid cooling system includes a pump for supplying a cooling liquid including water, a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the pump. Different parts of the liquid cooling system are provided with different corrosion resistance against the cooling liquid.

Growing community of inventors

Tsukuba, Japan

Rintaro Minamitani