Senju Metal Industry Co., Ltd.

Rina Horikoshi

Hiroyoshi Kawasaki

Masato Shiratori

Kazuya Kitazawa

Tomoko Nagai

Kazuyori Takagi

Nanako Miyagi

Yutaka Hashimoto

Toru Hayashida

Kazuhiro Minegishi

Akiko Takaki

Ryuichi Tsuda

Teppei Otsuki

Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (carboxyalkyl)isocyanurate adduct is a mono(carboxyalkyl)isocyanurate adduct, a bis(carboxyalkyl)isocyanurate adduct, a tris(carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

Flux and solder paste

Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass %. The flux also contains 0-20 mass % of a block organic acid and 0-3 mass % of an activator.

Flux for solder paste and solder paste

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Tokyo, Japan

Rina Horikoshi