Shinko Electric Industries Co., Ltd.

Riku Nishikawa

Masahiro Sunohara

Akihiro Kuribayashi

A substrate fixing device includes a base plate, a ceramic plate, and a thermal conduction member. The ceramic plate is bonded to the base plate via an adhesive layer, and has an electrode embedded therein for generating heat, and configured to adsorb a substrate by electrostatic force. The thermal conduction member is arranged in at least one of an adhesive surface of the ceramic plate, an adhesive surface of the base plate, and an inside of the adhesive layer, and having thermal conductivity in a stack direction of the base plate and the ceramic plate higher than thermal conductivity in a plane direction perpendicular to the stack direction.

Substrate fixing device

A substrate fixing device includes: an electrostatic chuck that is configured to adsorb and retain an object thereon, and including a base body on which the object is mounted, and an electrostatic electrode that is provided in the base body; and a base plate on which the electrostatic chuck is mounted, and having a plurality of through holes each exposing a first face of the base body facing the base plate. Laser light is emitted from each of the through holes toward the base body.

A substrate fixing device includes a base plate, a ceramic plate fixed to the base plate and configured to adsorb a substrate by electrostatic force, and an adhesive layer bonding the base plate and the ceramic plate. The adhesive layer includes a plurality of linear heat transfer bodies arranged adjacent to each other such that a longitudinal direction of each linear heat transfer body is along a stack direction of the ceramic plate and the base plate, and a resin filled between adjacent heat transfer bodies of the heat transfer bodies and bonded to the ceramic plate and the base plate.

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Nagano, Japan

Riku Nishikawa