Denso Corporation

Rikiya Kamimura

Toshihisa Taniguchi

Yoshihiko Shiraishi

Tohru Nomura

Yoshihiro Shimoide

Hisao Kuroki

Hiroshi Kasugai

Atsusi Sakaida

Katsumi Nakamura

Kouji Kond

A thick film circuit board that can be produced at a low cost, a method of producing the same, and an integrated circuit device. A first thick film circuit board has conducting layers of a copper-containing conductor fired at not higher than 750&#xb0; C., and includes conducting portions formed by using a silver-containing conductor. A second thick film circuit board has conductors that are formed in the through holes so as to close the openings of at least the one side thereof. The thick film circuit board is produced at a low cost and suppresses a drop in electric conductivity when it is in use.

Thick film circuit board, method of producing the same and integrated circuit device

The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipmentand resin-metal separation equipmentare used in hot filtration process P. The waste printed circuit boardis heated and force-filtered so that only the insulating materialpass through the filter. Then, the insulating materialand the metallic materialare separated and retrieved. It is preferred that the insulating body baseof the printed circuit boardas the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. As a result, when the retrieved metallic material and the retrieved insulating material amount to necessities of recycling respectively, both the metallic material and the insulating material are possible for recycling.

Method of recycling printed circuit board

Drive electrodes and sensing electrodes are formed on a front face of a piezoelectric body of a vibrator. A first reference electrode is formed on a rear face. Second reference electrodes are formed on side faces of arm bars of the vibrator at a position corresponding to the sensing electrodes. The second reference electrodes are connected to the first reference electrode formed on said rear face.

Angular velocity sensor, related method for manufacturing the sensor, and piezoelectric vibrator element used in this sensor

Growing community of inventors

Toyoake, Japan

Rikiya Kamimura