Average Co-Inventor Count = 4.10
ph-index = 1
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Kaneka Corporation (8 from 1,707 patents)
2. Japan Aerospace Exploration Agency (7 from 241 patents)
8 patents:
1. 12305003 - Polyamic acid having specific composition, varnish, cured product, and composite material
2. 11492446 - Semipreg, prepreg, resin composite material, and production methods thereof
3. 10815390 - Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4'-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof
4. 10526450 - Terminally modified imide oligomer, varnish, cured products thereof, film, and imide prepreg and fiber-reinforced composite material using these
5. 10047246 - Varnish including 2-phenyl-4,4'-diaminodiphenyl ether, imide resin composition having excellent moldability, cured resin molded article having excellent breaking elongation, prepreg thereof, imide prepreg thereof, and fiber-reinforced material thereof having high heat resistance and excellent mechanical strength
6. 10017666 - Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4'-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof
7. 9051430 - Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4'diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance
8. 8846552 - Soluble terminally modified imide oligomer using 2-phenyl-4, 4'-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance