Jsr Corporation

Rikimaru Kuwabara

Yukio Hosaka

Takahiro Okamoto

Hiroyuki Morita

Tsuyoshi Watanabe

Takaomi Matsumoto

Koichiro Tani

Keisuke Kuriyama

Shoei Tsuji

Takafumi Shimizu

Ryota Funaki

A production process of a rubber composition containing a modified conjugated diene-based polymer, which can provide a rubber composition in which processability is excellent, and a filling agent, when contained, has favorable dispersibility therein. The production process of the rubber composition includes: a first step of kneading a modified conjugated diene-based polymer that is obtained by polymerizing a monomer containing a conjugated diene compound and has at least one nitrogen-containing functional group selected from a primary amino group, a secondary amino group, a tertiary amino group and groups in which these amino groups have been converted into an onium group, and a basic compound having an acid dissociation constant of 8.0 or more; and a second step of kneading the kneaded product obtained in the first step and a cross-linking agent.

Production process of rubber composition

A composition for forming a chemical mechanical polishing pad having polishing characteristics such as a high polishing rate, an excellent planarity of the polished object, and less scratches of the polished object. The composition includes (A) a polyurethane having a carbon-carbon double bond on a side chain and (B) a cross-linking agent. The polyurethane (A) is preferably a thermoplastic polyurethane (A') obtained by mixing at least components (a11) to (a13) and component (a2) in a proportion satisfying the following conditions (1) and (2) and reacting them.

Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method

The present invention relates to polishing pads, including at least 60 to 99 parts by weight of a polymer matrix (A) having 1,2-polybutadiene; and 1 to 40 parts by weight of component (B) having a copolymer having a polyether block, where the total amount of the polishing pad is 100 parts by mass, polymer matrix (A) includes 1,2-polybutadiene in an amount of at least 60 parts by weight, relative to 100 parts by mass of the polishing pad, component (B) includes the copolymer having a polyether block in an amount of at most 40 parts by weight relative to 100 parts by mass of the polishing pad, and the polishing pads have a surface resistivity of 2.6&#xd7;10to 9.9&#xd7;10&#x3a9;.

Chemical mechanical polishing pad

There is provided a method for producing a chemical mechanical polishing pad, the method comprising the steps of (1) producing a sheet-shaped polymer molded article and (2) irradiating the sheet-shaped polymer molded article with an electron beam within an irradiation dose of 10 to 400 kGy. A chemical mechanical polishing pad produced by the above method has advantages that it is excellent in removal rate and scratches and in-plane uniformity on a polished surface and that it shows a stable removal rate even when polishing a number of objects to be polished successively.

Method for producing chemical mechanical polishing pad

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Chuo-ku, Japan

Rikimaru Kuwabara