Kaijo Corporation

Riki Jindo

Hideki Yoshino

Akio Sugito

Mami Kushima

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary () having a through hole through which a wire () is to be inserted; a holding unit, which is provided above the capillary (), and is configured to hold the wire () inserted through the capillary (); and a vibrating unit configured to vertically vibrate the capillary (). Under a state in which the holding unit holds the wire (), the vibrating unit vertically vibrates the capillary () so that the wire () is protruded from the leading end of the capillary.

Method of vertically vibrating a bonding arm

A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing an amount of antioxidant gas that is used are provided. The work clamp includes an interior hollow portionproviding an atmosphere of the antioxidant gas, a lower opening portionprovided below the interior hollow portion, for containing the bonding area in the interior hollow portion, an upper opening portionprovided above the interior hollow portion, for exposing the bonding area, a cavitycovering the interior hollow portion and having an area larger than an opening area of the upper opening portion, gas introduction ports,provided at the cavity, for introducing the antioxidant gas into the cavity, and holesconnected to below the cavity, for blowing the antioxidant gas introduced from the gas introduction port to a portion other than the bonding area of the work.

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Tokyo, Japan

Riki Jindo