Qualcomm Mems Technologies, Inc.

Rihui He

David Leslie Heald

Charles Chengyea Leu

Evgeni Petrovich Gousev

Kostadin Dimitrov Djordjev

Ming-Hau Tung

Alok Govil

Cheonhong Kim

Lauren Palmateer

Kasra Khazeni

Bing Wen

Bangalore Ramaswamiengar Natarajan

Wilhelmus Johannes Robertus Van Lier

Jae Hyeong Seo

Edward Keat Leem Chan

Tsongming Kao

Sriram Akella

Lingling Wu

Chih-Hsiang Ho

Yen Hua Lin

This disclosure provides systems, methods and apparatus for an arrangement of pixels and interconnects in a display. In one aspect, polarities of pixels may be in a dot inversion configuration, or checkerboard pattern, to reduce the visibility of flicker. Various interconnect alternatively couple between modules in different columns or rows to provide dot inversion.

Dot inversion configuration

This disclosure provides systems, methods and apparatus for EMS devices. In one aspect, an EMS device includes an array of display elements and a plurality of driver lines with at least a portion of the plurality of driver lines routed above or below the array between one or more driver circuits and the array. In some implementations, at least a portion of the plurality of driver lines is disposed above a non-active area of the array. In one aspect, an EMS device can form a portion of at least one of the plurality of driver lines. In some implementations, movable layers of the array can be disposed between at least a portion of the plurality of driver lines and stationary electrodes of the display.

Electromechanical systems device

A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.

Optimization of desiccant usage in a MEMS package

Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.

Electromechanical device treatment with water vapor

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San Jose, CA, United States of America

Rihui He