Panasonic Intellectual Property Management Co., Ltd.

Rihoko Watanabe

Hiroharu Inoue

Keiko Kashihara

Hiroaki Umehara

Yiqun Wang

Jun Yasumoto

Teppei Washio

A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan δ=E″/E') of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).

Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1): wherein in the formula, p represents an integer of 1 to 10, in which the content ratio of the component (A) to the component (B) is (A):(B)=50:50 to 90:10 in mass ratio.

Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.

Prepreg, metal-clad laminate and printed wiring board

A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9&#x2264;X/X&#x2264;1.0 (I), where Xis a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and Xis a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.

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Osaka, Japan

Rihoko Watanabe