Sumitomo Bakelite Company Limited

Rie Takayama

Toyosei Takahashi

Mitsuo Sugino

Junya Kusunoki

Masakazu Kawata

Kazuto Oonami

Seiji Oohashi

Hirohisa Dejima

A method of manufacturing a light receiving deviceincludes: providing a resin layercontaining a photo curing resin on a transparent substratewhere a plurality of transparent substrate portionsA are integrated so that the resin layer covers the transparent substrate; selectively irradiating the resin layerwith light, followed by a developing process, so that the resin layerremains in regions of the transparent substratewhich surround portions corresponding to regions facing light receiving portionsin the transparent substrate portionsA; dividing the transparent substrateinto units of transparent substrate portionsA so that a plurality of transparent substrate portionsA are obtained; dividing the base substrateinto units of base substrate portionsA so that a plurality of base substrate portionsA are obtained; and joining the base substrate portionsA and the transparent substrate portionsA via the resin layer

Method of manufacturing light receiving device

A light receiving deviceincludes a support substrateprovided thereon with a photodetectorincluding a photodetecting portionand a base substrateon which the photodetecting portionis placed; and a transparent substratedisposed so as to oppose the face of the support substrateon which the photodetectoris provided. Between the support substrateand the transparent substrate, a frame portionis provided so as to surround the photodetector. The frame portionis a photo-curing adhesive, and directly adhered to the transparent substrateand the support substrate. Such structure provides a light receiving device capable of exhibiting the desired performance, and a method of manufacturing such light receiving device can also be provided.

Light receiving device and method of manufacturing light receiving device

A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

Resin composition, filling material, insulating layer and semiconductor device

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Tokyo, Japan

Rie Takayama