Intel Corporation

Ridza Effendi Abd Razak

Bok Eng Cheah

Jackson Chung Peng Kong

Yen Hsiang Chew

Kooi Chi Ooi

Shanggar Periaman

Michael P Skinner

Kheng Tat Mar

A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.

Flexible packaging architecture

Growing community of inventors

Lunas, Malaysia

Ridza Effendi Abd Razak