Vitesco Technologies Gmbh

Rico Hartmann

Jens Reiter

Christian Lammel

A method provides a circuit carrier arrangement that includes: a cooling plate () which has spacer and fastening elements () for connection to a printed circuit board () in a spaced-apart manner; a printed circuit board () which has bores () for receiving spring element sleeves (); at least one power semiconductor component () which is connected by a soldered connection to the printed circuit board () and fastening elements () in the state in which it is fitted with the cooling plate () by means of plug-in connections () of spring-action configuration; and at least one spring element () having at least two spring element sleeves () between which a web () that is connected to the spring element sleeves () extends, and supporting elements () arranged on either side of said web and at least one spring plate () being arranged on said web.

Circuit carrier arrangement and method for producing such a circuit carrier arrangement

A circuit carrier arrangement includes: a cooling plate () which has spacer and fastening elements () for connection to a printed circuit board () in a spaced-apart manner; a printed circuit board () which has bores () for receiving spring element sleeves (); at least one power semiconductor component () which is connected by a soldered connection to the printed circuit board () and fastening elements () in the state in which it is fitted with the cooling plate () by means of plug-in connections () of spring-action configuration; and at least one spring element () having at least two spring element sleeves () between which a web () that is connected to the spring element sleeves () extends, and supporting elements () arranged on either side of said web and at least one spring plate () being arranged on said web.

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Munich, Germany

Rico Hartmann