Sgs-Thomson Microelectronics Limited

Thomson Components-Mostek Corporation

Ricky Parkinson

Robert Henry Bond

Michael A Olla

Linn C Garrison

Barry L Morrison

Steven Swendrowski

John D Pace

An apparatus for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and then knocks a die down from the array of dice into a receptacle for transport to further processing stages.

Chip selection in automatic assembly of integrated circuit

A method for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and the knocks a die down from the array of dice into a receptacle for transport to further processing stages.

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Lewisville, TX, United States of America

Ricky Parkinson