Seagate Technology Incorporated

Rick Pfahl Freeman

Andrew Robert Motzko

Neal Frank Gunderson

Erik Jon Lindquist

Michael D Schroeder

Zine Eddine Boutaghou

John Stuart Wright

Jason Wayne Riddering

Stefan Andrei Ionescu

Daniel Dennis Dittmer

Antanas Daugela

Subra Nagarajan

David D Backlund

Michael Henry Lennard

Karsten Klarqvist

Fei Wang

Andy M Motzko

Erick J Lindquist

A system includes a first preamplifier, a second preamplifier and a flex circuit. The first preamplifier is configured to be connected to a first plurality of recording heads. The second preamplifier is configured to be connected to a second plurality of recording heads. At least one of the first plurality of recording heads and at least one of the second plurality of recording heads are configured to concurrently perform read and or write operations. The flex circuit is a single flex circuit configured to connect the first and second preamplifiers to the plurality of recording heads.

Flexible circuit for concurrently active recording heads

An actuator for selectively positioning a portion of a communication channel formed by a cable circuit having a protuberant component connected at a proximal end to a flexible base, whereby the actuator defines a heat transfer surface operably disposed in thermal conductivity with a distal surface of the protuberant component for sinking heat from the component to the actuator.

Sinking heat from an integrated circuit to an actuator

An actuator for supporting data transfer elements includes an arm, a flexible circuit assembly and a sensor. The flexible circuit assembly includes a stiffener having a mount feature and a turnaround feature. The flexible circuit assembly also includes a flexible cable having a plurality of conductive traces for electrically connecting the data transfer elements to circuitry. The flexible cable has a service loop portion, a mounting portion coupled to the mount feature of the stiffener and a turnaround portion coupled to the turnaround feature of the stiffener. The turnaround portion is configured to couple the mounting portion to the service loop portion. The sensor is in contact with a surface of the arm and is electrically coupled to the flexible cable.

Arm mounted shock sensor and flexible circuit routing

In accordance with various embodiments, a printed structure of a flex circuit assembly includes a plurality of adjacent land portions formed on a heat conductive stiffener member and which support electrically conductive paths for connection to an integrated circuit. A corresponding plurality of separation channels are formed between the adjacent electrically conductive paths, and thermal energy generated by operation of the integrated circuit is transferred through the separation channels to the stiffener member. In some embodiments, the separation channels retain a fluid, such as air or a low density inert gas, which flows through the separation channels in response to rotation of a rotatable member adjacent the flex circuit assembly. In other embodiments, a dielectric, thermally conductive material fills the separation channels.

Flex circuit assembly with thermal energy dissipation

Apparatus and method for head-disc interface (HDI) modal response monitoring. A sensing element disposed on a rigid actuator arm is mechanically impedance matched to a head-disc interface (HDI) supported by the actuator arm to resonate at a predetermined frequency corresponding to at least one disturbance associated with the HDI.

Head-disc interface (HDI) modal response monitoring

A FOS is provided for electrically connecting a data transfer head with a PCCA. The FOS comprises a polymeric layer supporting an electrical trace. The electrical trace comprises an uninsulated pad surface configured for electrically engaging a solder interconnect of the PCCA. The polymeric layer comprises a continuous portion covering the pad and opposing the pad surface. A method is provided comprising providing the FOS comprising the electrical trace and the polymeric covering, contactingly engaging the pad surface portion of the trace with the solder interconnect portion of the PCCA, and conducting heat through the polymeric covering to reflow the solder interconnect, thereby electrically connecting the FOS to the PCCA.

Flex on suspension with a heat-conducting protective layer for reflowing solder interconnects

The present invention includes a method and apparatus for attenuating flexible circuit resonance. The apparatus includes a flexible circuit assembly. The flexible circuit assembly has a flexible circuit having a flexible cable with first and second sides. The flexible circuit assembly also includes a circuit support. The circuit support includes a base having top and bottom surfaces. The bottom surface is attached to the first side of the flexible cable. The circuit support also includes a support wall extending substantially perpendicularly relative to the top surface of the base. The support wall has a first face, which is substantially oriented towards the top surface of the base. The first side of the flexible cable is attached to the first face and also faces a second face of the support wall to thereby reverse a direction in which the flexible cable faces.

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Northfield, MN, United States of America

Rick Pfahl Freeman