Bae Systems Information and Electronic Systems Integration Inc.

Nuvotronics, LLC

Teraconnect, Incorporated

Schilmass Co. L.l.c.

Rick L Thompson

Daniel N Carothers

Daniel J Creeden

Peter Ketteridge

Andrew T S Pomerene

Kenneth J Vanhille

Craig M Hill

Anatoliy Boryssenko

Mani Sundaram

Vu Anh Vu

Richard J Williams

York E Young

Robert L Kamocsai

Timothy J Conway

Jason S Bundas

Barry R Arsenault

Alan E Tobey

Joe Giunta

Jonathan N Ishii

Jean Marc Rollin

Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates. The device comprising a 3D coaxial distribution network structure including a plurality of coaxial transmission lines separated by a first pitch at the input and a second, wider pitch at the output thereof.

Wafer scale test interface unit and contactors

A system is provided for the manufacture of carbon based electrical components including, an ultraviolet light source; a substrate receiving unit whereby a substrate bearing a first layer of carbon based semiconductor is received and disposed beneath the ultraviolet light source; a mask disposed between the ultraviolet light source and the carbon based semiconductor layer; a doping agent precursor source; and environmental chemical controls, configured such that light from the ultraviolet light source irradiates a doping agent precursor and the first carbon layer.

Photo-patterned carbon electronics

Fuzzy logic is utilized to control an RF amplifier and associated tuner for continuous self-optimization and automatic load matching to at least double the battery life of a battery-powered transmitter.

Fuzzy logic control of an RF power amplifier for automatic self-tuning

A method for the manufacture of carbon based electrical components is herein presented. In the method a wafer substrate is provided upon which a first layer of carbon based semiconductor is deposited. The first layer of carbon based semiconductor is introduced to a first doping agent precursor and the first doping agent precursor and first layer of carbon based semiconductor are irradiated with light having a wavelength in the ultraviolet spectrum thereby selectively doping areas of the first layer of carbon based semiconductor.

Method for the production of photo-patterned carbon electronics

A method for fabricating photonic and electronic devices on a substrate is disclosed. Multiple slabs are initially patterned and etched on a layer of a substrate. An electronic device is fabricated on a first one of the slabs and a photonic device is fabricated on a second one of the slabs, such that the electronic device and the photonic device are formed on the same layer of the substrate.

Method for fabricating electronic and photonic devices on a semiconductor substrate

Techniques for generating terahertz (THz) radiation are provided in which each nonlinear crystal in an array of such crystals is coupled to one or more corresponding waveguides such that any THz radiation generated in any single crystal is coupled into that crystal's THz waveguide structure. After the THz radiation is generated in the crystals and coupled into the waveguides, the individual THz signals may be coherently combined to form a single THz signal (non-coherent configurations are provided as well). Crystal-waveguide arrays embodying the techniques can be used to implement efficient, robust, and compact THz sources suitable for applications such as security screening, medical imaging, quality control and process monitoring in manufacturing operations, and package and container inspection.

Nonlinear crystal and waveguide array for generation of terahertz radiation

The present invention features a packaging system for two-dimensional optoelectronic arrays. In one embodiment, the packaging includes a heat spreader, a housing with embedded electrical interconnections, a substrate including electrical contacts, an application specific integrated circuit (ASIC) including a hybridized array with vertical cavity surface emitting laser (VCSEL), detectors or both. The waveguide assembly includes a plurality of individual one-dimensional waveguides formed in waveguide sheets, wherein the waveguides match the array footprint on one end and a connector footprint on the other end.

Packaging system for two-dimensional optoelectronic arrays

Growing community of inventors

Amherst, NH, United States of America

Rick L Thompson