Sonosite, Inc.

Rick Hippe

Wei Li

Allan Coleman

Systems and methods which improve the directivity of a transducer array by reducing electrical cross-talk between conductors connected to individual transducer array elements through the use of a plurality of interconnect circuits are shown. A plurality of signal transmission path circuits, such as circuit boards, flexible printed circuits, etc., are used to provide electrical power to and receive signals from transducer elements of a transducer array. Embodiments couple transducer elements to conductive traces of the signal transmission path circuits in a manner such that adjacent transducer elements are not connected to conductive traces on the same signal transmission path circuit. In some embodiments, a plurality of signal transmission path circuits are offset such that two identical signal transmission path circuits can be used to provide connectivity to array transducer elements using more widely spaced conductive traces, thus reducing electrical cross-talk effects.

Growing community of inventors

Snohomish, WA, United States of America

Rick Hippe