Varex Imaging Corporation

Rick E Colbeth

Ivan Petrov Mollov

Some embodiments include a method, comprising: attaching a carrier substrate to a side of at least one semiconductor substrate, the at least one semiconductor substrate including photodetectors on the side; thinning the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; attaching an optical substrate to the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; and removing the carrier substrate from the at least one semiconductor substrate.

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San Jose, CA, United States of America

Rick E Colbeth