Asm Fico Tooling B.v.

Other

Richardus H Fierkens

Ireneus J Pas

Dirk De Kler

Ireneus J Maria Pas

An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.

Automatic continuously cycleable molding system and method

Automatic continuously cycleable molding system

A receiving and arranging apparatus for bringing electronic components, or other workpieces, into a molding apparatus and unloading them from suitable magazines into a mechanism which arranges them in a proper orientation for placement into a mold. The apparatus includes a vertically movable and horizontally rotatable turntable mechanism which operates in conjunction with a conveyor system to arrange the electronic components in a side by side manner for transfer to a subsequent workstation in the molding process.

A lead frame for applying micro-electronic elements thereon, which lead frame comprises a series of lead patterns disposed at mutually equal pitch distances, each consisting of a carrier plate lying on the axis of the frame for applying a micro-electronic element thereto, further of leads terminating a short distance from said carrier plate, said leads being connected to lands extending perpendicularly to the frame axis and disposed on either side of the carrier plate, said leads extending beyond said lands in mutually parallel relationship so as to form lead terminals, as far as the next land of the adjoining lead pattern and being connected thereto, while the parallel leads of adjoining patterns are shifted relatively to each other in transverse direction: the mutual distance between two lands associated with one lead pattern is equal to the width of the standardized resin envelope of the micro-electronic element, the lands being provided with cuts in a direction approximately parallel to the axis of the lead frame, said cuts extending form the land edge oriented towards the carrier plate and terminating a short distance from the opposite land edge.

Lead frame

A method and apparatus for cold runner transfer molding. Insulating and/or cooling means are provided so that the mold runnerblock is kept sufficiently cool to prevent curing of the plastic molding compound therein. By the addition of a plunger near the gate of the mold, a quasi-continuous molding operation may be effected. Local preheating of the molding material at the gate locale may be used to liquefy a feedstock which has travelled through the cold-runners in powdered form.

Apparatus for cold runner transfer molding

Automatic continuously cycleable molding apparatus

Apparatus is provided for bending one or two complete rows of leads on a dual-in-line semiconductor package at one time without damaging the leads. The leads of the dual-in-line package are initially in their manufactured position, extending horizontally from the sides of the package and generally parallel to the top and bottom surface thereof. A support anvil is placed under the portion of the lead which is sealed in the semiconductor package, and a punch or bending member is disposed immediately adjacent the outside edge of the handle for performing the actual bending. A sheet of relatively thin metal is formed into a U-shaped channel and the bending member inserted therein before lowering so that as the bending member is lowered, no portion thereof touches the surface of the leads being bent. The sheet of thin metal buffers the bending operation and is interposed between the bottom and side of the bending member and the face of the leads for preventing scratching or damage thereto. At the end of the downward movement of the bending member, the row of leads is substantially nearly vertical and the anvil, sheet of metal and punch may be removed for the next successive dual-in-line package. For two row operation, both the anvil and the punch include die portions for bending the leads and the steel sheets are wound and unwound for protecting the leads being bent. A method of bending is also provided using a punch partially covered with a thin sheet of steel.

Method and apparatus for touch-free lead bending

A method and apparatus for cleaning at least selected surfaces of a mold apparatus to remove plastic residue and surface contaminates and impurities to enable the molds to be used in a continuous in-line type process for encapsulating lead frame assemblies or similar semi-conductor circuits. After the molds are separated and the large pieces of excess plastic are broken away, they are transported to a vacuum chamber and electrically coupled as, or at least proximate, the cathode. The vacuum chamber is evacuated and an inert ionizable gas such as argon is admitted. An electrical field is established between the anode and cathode to create a plasma or glow discharge causing the gas to ionize. The positive ions are accelerated by the electrical field toward the cathode and bombard at least selected areas of the mold portion to be cleaned for removing surface contaminates and producing an extremely clean surface to enable the mold portion to be used again and again in a continuous cyclical or in-line process. Portions of the mold surface which are not to be bomdarded by ions, may be masked or shielded during the reverse sputtering operation.

Method and apparatus for mold cleaning by reverse sputtering

Method for encapsulating microelectronic elements, starting from strip-like material including a number of interconnected conductor patterns each having a number of leads for the microelectronic element to be encapsulated, which comprises applying a microelectronic element or crystal in the center of each conductor pattern, the terminal means of which are connected to the leads of the conductor pattern, after which the crystal-carrying strip-like material is so positioned in a mould that each crystal is substantially in the center of a mould cavity, which cavity is subsequently poured with an encapsulating synthetic material, wherein on each crystal-carrying conductor pattern on either side of the strip-like material a mould half provided with an aperture is placed in such a manner that the two apertures together form the mould cavity for the encapsulating material, the two mould halves serving as a permanent encapsulation for the crystal after pouring of the mould cavity.

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Herwen, Netherlands

Richardus H Fierkens