Infineon Technologies Ag

Cree Gmbh

Wolfspeed, Inc.

Macom Technology Solutions Holdings, Inc.

Infineon Technologies Americas Corp.

Richard Wilson

Haedong Jang

Timothy Canning

Saurabh Goel

Frank Trang

Bjoern Herrmann

Bayaner Arigong

David Seebacher

Zulhazmi Mokhti

Madhu Chidurala

Rongguo Zhou

Christian Schuberth

Simon Ward

Alexander Komposch

Peter Singerl

Helmut Brech

Marvin Marbell

Qianli Mu

Michael Lefevre

E J Hashimoto

Björn Herrmann

Tim Canning

Ej Hashimoto

A radio frequency (RF) package includes a support having a semiconductor die attach region; a frame that includes an electrically insulative member having a lower side attached to the support and an upper side opposite the support; the frame includes an opening at least partially registered with said semiconductor die attach region; and the frame includes an upper metallization at the upper side of the electrically insulative member and a lower metallization The frame includes first electrically conductive edge connection connecting the first metallization to the first lower metallization.

Radio frequency package implementing a window frame with edge plating and processes of implementing the same

A multi-level radio frequency (RF) integrated circuit component includes an upper level including at least one inductor, and a lower level including at least one conductive element that provides electrical connection to the at least one inductor. The lower level separates the at least one inductor from a lower surface that is configured to be attached to a conductive pad. Related integrated circuit device packages are also discussed.

Multi level radio frequency (RF) integrated circuit components including passive devices

A packaged radio frequency transistor amplifier includes a package housing, an RF transistor amplifier die that is mounted within the package housing, a first capacitor die that is mounted within the package housing, an input leadframe that extends through the package housing to electrically connect to a gate terminal of the RF transistor amplifier die, and an output leadframe that extends through the package housing to electrically connect to a drain terminal of the RF transistor amplifier die. The output leadframe includes an output pad region, an output lead that extends outside of the package housing, and a first arm that extends from one of the output pad region and the output lead to be adjacent the first capacitor die.

Radio frequency transistor amplifiers having leadframes with integrated shunt inductors and/or direct current voltage source inputs

An amplifier includes an input matching network; at least one transistor; an input lead coupled to the at least one transistor; a ground terminal coupled to the transistor; an output lead coupled to the at least one transistor; an output matching circuit coupled to the output lead and to the at least one transistor; and a baseband impedance enhancement circuit having at least one reactive element coupled to the input matching network. The baseband impedance enhancement circuit is configured to reduce resonances of a baseband termination.

Radio frequency amplifier implementing an input baseband enhancement circuit and a process of implementing the same

Inductance-capacitance (LC) resonators having different resonant frequencies, and radio frequency (RF) transistor amplifiers including the same. One usage of such LC resonators is to implement RF short/DC block circuits. A RF transistor amplifier may include a transistor on a base of the RF transistor amplifier coupled to an input and an output of the RF transistor amplifier; a first inductance-capacitance (LC) resonator comprising a first inductance and a first capacitance; and a second LC resonator comprising a second inductance and a second capacitance. The first LC resonator may be configured to resonate at a first frequency, and the second LC resonator may be configured to resonate at a second frequency different from the first frequency.

Wideband RF short/DC block circuit for RF devices and applications

RF amplifiers are provided that include a submount such as a thermally conductive flange. A dielectric substrate is mounted on an upper surface of the submount, the dielectric substrate having a first outer sidewall, a second outer sidewall that is opposite and substantially parallel to the first outer sidewall, and an interior opening. An RF amplifier die is mounted on the submount within the interior opening of the dielectric substrate, where a longitudinal axis of the RF amplifier die defines a first axis. The RF amplifier die is positioned so that a first angle defined by the intersection of the first axis with the first outer sidewall is between 5&#xb0; and 45&#xb0;. The dielectric substrate may be a ceramic substrate or a dielectric layer of a printed circuit board.

Radio frequency amplifiers having improved shunt matching circuits

An amplifier circuit includes a first port, a second port, a reference potential port, and an RF amplifier device having a first terminal electrically coupled to the first port, a second terminal electrically coupled to the second port, and a reference potential terminal electrically coupled to the reference potential port. The RF amplifier device amplifies an RF signal across an RF frequency range that includes a fundamental RF frequency. An impedance matching network is electrically coupled to the first terminal and the first port. The impedance matching network includes a baseband termination circuit that presents low impedance in a baseband frequency region, a fundamental frequency matching circuit that presents a complex conjugate of an intrinsic impedance of the RF amplifier device in the RF frequency range, and a second order harmonic termination circuit that presents low impedance at second order harmonics of frequencies in the fundamental RF frequency range.

RF power amplifier with combined baseband, fundamental and harmonic tuning network

An amplifier circuit includes an input port, an output port, and a reference potential port, an RF amplifier device having an input terminal electrically coupled to the input port, an output terminal electrically coupled to the output port, and a reference potential terminal electrically coupled to the reference potential port. An impedance matching network is electrically connected to the output terminal, the reference potential port, and the output port. The impedance matching network includes a reactive efficiency optimization circuit that forms a parallel resonant circuit with a characteristic output impedance of the peaking amplifier at a center frequency of the fundamental frequency range. The impedance matching network includes a reactive frequency selective circuit that negates a phase shift of the RF signal in phase at the center frequency and exhibits a linear transfer characteristic in a baseband frequency range.

RF power amplifier with frequency selective impedance matching network

A packaged amplifier circuit includes an RF package with a die pad, and RF input and output leads extending away from the die pad opposite directions. An RF transistor die is mounted on the die pad such that a first outer edge side of the RF transistor die faces the first RF lead and a second outer edge side of the RF transistor die faces the second RF lead. A passive electrical connector is integrally formed in the RF transistor die. The passive electrical connector includes a first end connection point closer to the first outer edge side, and a second end connection point closer to the second outer edge side. A first discrete reactive device is mounted on the die pad between the first outer edge side and the first RF lead. The passive electrical connector electrically couples the first discrete reactive device to the second RF lead.

RF amplifier with impedance matching components monolithically integrated in transistor die

The operative bandwidth of a broadband RF amplifier is improved by using a low-pass type broadband impedance transformer, instead of a broadband matching network, in a multi-stage impedance matching network connected, e.g., to the amplifier input. The multi-stage impedance matching network comprises three stages connected in series. The first stage is a low-pass type broadband impedance transformer that provides broadband fundamental impedances and high reflection for the second harmonics. The second stage is a phase shifter that controls the location of the second harmonic reflection coefficient phases. The third stage is a high-pass input matching circuit that transforms the complex conjugate device input impedance to a real impedance. The three-stage impedance matching network provides the fundamental and harmonic frequency impedances for broadband operations, as well as controllability of the second harmonic reflection coefficient phases where the device performances are consistent across the intended bandwidth. The multi-stage impedance matching network may be connected to the input of an RF amplifier, the output, or both.

Broadband harmonic matching network using low-pass type broadband matching

Embodiments of an RF amplifier package include a body section comprising an upper surface having first and second opposing edge sides, and a die pad vertically recessed beneath the upper surface and comprising first and second opposing sides and a third side intersecting with the first and second sides. Embodiments also include first and second leads disposed on the upper surface, the second lead extending from adjacent to the second side to the second edge side; and a biasing strip connected to the second lead and disposed on the upper surface adjacent to the third side. Other embodiments include packaged RF amplifiers comprising an RF amplifier package, and an RF transistor mounted on the die pad and comprising: a control terminal electrically coupled to the first lead, a reference potential terminal directly facing and electrically connected to the die pad, and an output terminal electrically connected to the second lead.

RF amplifier package with biasing strip

A phase shifter having a four port hybrid coupler is provided. The four port hybrid coupler has first and second input ports and first and second output ports. The four port hybrid coupler is configured to shift the phase of an RF signal as between the first and second input ports. First and second active semiconductor devices are connected to first and second output ports. The first and second active semiconductor devices are configured to change the phase shift of the RF signal as between the first and second input ports based upon a varying voltage.

Reflection type phase shifter with active device tuning

Exemplary impedance matching circuit for an amplifier device comprises a broadband impedance transformer configured to transform, over a fundamental frequency range, an impedance associated with an input port or an output port of the impedance matching circuit; and to transmit RF signals having a fundamental frequency within the fundamental frequency range. The impedance matching circuit also includes a phase shifter circuit configured to transmit, with substantially matched impedance, the RF signals having a fundamental frequency within the fundamental frequency range, and to phase-shift higher-order harmonics of the RF signals. The impedance matching circuit also includes a high-pass impedance transformer configured to match an impedance of the RF signals having a fundamental frequency within the fundamental frequency range; and to transmit, with low reflection, second-order harmonics of the RF signals. Exemplary embodiments also include amplifier circuits comprising an RF amplifier and embodiments of the impedance matching circuit.

Broadband harmonic matching network

Exemplary embodiments including an amplifier circuit that includes a radio-frequency (RF) amplifier comprising an input terminal and an output terminal, the RF amplifier being configured to amplify, across a wideband frequency range, an RF signal applied to the input terminal to generate an amplified RF signal at the output terminal. The amplifier circuit also includes a first impedance matching network connected to the RF amplifier output terminal. The first impedance matching network includes a first reactive circuit, having substantially fixed impedance, connected between the RF amplifier input terminal and ground; a second reactive circuit; and a switching device configured to couple the second reactive circuit to the first reactive circuit in an ON state, and to decouple the second reactive circuit from the first reactive circuit in an OFF state. In some embodiments, the amplifier circuit can include a second impedance matching network connected to the RF amplifier input terminal.

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Morgan Hill, CA, United States of America

Richard Wilson