Freescale Semiconductor,inc.

Everspin Technologies, Inc.

Richard Williams

Gregory W Grynkewich

Brian R Butcher

Mark A Durlam

Kenneth H Smith

Kelly Wayne Kyler

Jaynal Abedin Molla

Clarence J Tracy

J Jack Ren

Thomas V Meixner

Charles A Synder

A method for contacting an electrically conductive layer overlying a magnetoelectronics element includes forming a memory element layer overlying a dielectric region. A first electrically conductive layer is deposited overlying the memory element layer. A first dielectric layer is deposited overlying the first electrically conductive layer and is patterned and etched to form a first masking layer. Using the first masking layer, the first electrically conductive layer is etched. A second dielectric layer is deposited overlying the first masking layer and the dielectric region. A portion of the second dielectric layer is removed to expose the first masking layer. The second dielectric layer and the first masking layer are subjected to an etching chemistry such that the first masking layer is etched at a faster rate than the second dielectric layer. The etching exposes the first electrically conductive layer.

Methods for contacting conducting layers overlying magnetoelectronic elements of MRAM devices

A method for fabricating a flux concentrating system () for use in a magnetoelectronics device is provided. The method comprises the steps of providing a bit line () formed in a substrate () and forming a first material layer () overlying the bit line () and the substrate (). Etching is performed to form a trench () in the first material layer () and a cladding layer () is deposited in the trench (). A buffer material layer () is formed overlying the cladding layer () and a portion of the buffer material layer () and a portion of the cladding layer () is removed.

Method for fabricating a flux concentrating system for use in a magnetoelectronics device

Structures for electrical communication with an overlying electrode for a semiconductor element and methods for fabricating such structures are provided. The structure for electrical communication with an overlying electrode comprises a first electrode having a lateral dimension, a semiconductor element overlying the first electrode, and a second electrode overlying the semiconductor element. The second electrode has a lateral dimension that is less than the lateral dimension of the first electrode. A conductive hardmask overlies the second electrode and is in electrical communication with the second electrode. The conductive hardmask has a lateral dimension that is substantially equal to the lateral dimension of the first electrode. A conductive contact element is in electrical communication with the conductive hardmask.

Methods and structures for electrical communication with an overlying electrode for a semiconductor element

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Chandler, AZ, United States of America

Richard Williams