Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Richard W Seaver

Frank D Derryberry

Michael W Cumbie

James Richard Przybyla

Garrett E Clark

Galen P Cook

Naoto A Kawamura

Colin C Davis

Pavel Kornilovich

Erik D Torniainen

Qin Liu

Jeffery S Hess

Donald E Wenzel

Colby Van Vooren

Carl Lan Wu

Alexander N Govyadinov

David A Champion

Anand Samuel Jebakumar

Chien-Hau Chen

Carson Denison

Oumnia El Fajri

Dennis Raymond Esterberg

Jeffrey Allen Nielsen

David Ridgway Otis, Jr

Christie Dudenhoefer

Si-lam Choy

Daniel J Fredrickson

Si-Iam J Choy

Si-Lam J Choy

Pavan Suri

Chien-Hua Chen

Charles Craig Haluzak

Timothy L Weber

Manish Giri

Craig Olbrich

David P Markel

David R Thomas

Dustin W Blair

Timothy E Beerling

David J Waller

John Liebeskind

William R Knight

Philip H Harding

James A Mott

Siddhartha Bhowmik

Alok Sharan

Manishi Giri

Galen Cook

An example microfluidic structure can include a first microfluidic channel segment in a first elevation plane, a second microfluidic channel segment in a second elevation plane, and a transverse microfluidic channel segment connecting the first microfluidic channel segment to the second microfluidic channel segment. An interior pillar can be positioned at the transverse microfluidic channel segment. The interior pillar can have a tapered downstream edge. The tapered downstream edge can be angled in the first or second elevation plane at an acute angle. A fluid cross-sectional area can increase in the fluid flow direction along the tapered downstream edge.

Microfluidic structures with interior pillars

An example microfluidic structure can include a first microfluidic channel segment in a first elevation plane, a second microfluidic channel segment in a second elevation plane, and a transverse microfluidic channel segment connecting the first microfluidic channel segment to the second microfluidic channel segment. An angled exterior wall segment can be at the transverse microfluidic channel segment. The angled exterior wall segment can be angled in the first or second elevation plane at an acute angle with respect to a direction of fluid flow through the first or second microfluidic channel segment. A fluid cross-sectional area can increase in the fluid flow direction along the angled exterior wall segment.

Microfluidic structures with angled exterior wall segments

An example microfluidic mixer can include an inlet microfluidic channel portion and a fluid splitting channel portion including an overpass microfluidic channel to receive fluid from a first side of the inlet microfluidic channel portion and an underpass microfluidic channel to receive fluid from a second side of the inlet microfluidic channel portion, where the underpass microfluidic channel extends under the overpass microfluidic channel such that the channels overlap at their respective downstream ends. A fluid recombining channel portion is downstream of the fluid splitting portion and includes an angled recombining surface having an acute angle with respect to a direction of fluid flow, where the angled recombining surface is between the downstream ends of the overpass and underpass microfluidic channels. An outlet microfluidic channel portion is fluidly connected downstream from the fluid recombining channel portion.

Microfluidic mixers

In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.

Nozzle arrangements

An immiscible droplet generation system may include a chip, a microfluidic channel integrated into the chip, an input to the microfluidic channel through which the microfluidic channel is to be filled with a first fluid that is to be moved through the microfluidic channel and a droplet generator. The droplet generator is integrated into the chip to generate a droplet of a second fluid, immiscible within the first fluid, and to inject the droplet into the first fluid in the microfluidic channel.

Droplet generator

In an example implementation, a sintering system includes a detection gas line to enable gas to flow into a sintering furnace from an external gas supply. The system includes a detection gas port inside the furnace through which gas from the detection gas line is to flow into the furnace, and a registration feature inside the furnace to enable positioning of a token green object proximate the gas detection port. The system includes a gas flow monitor to detect changes in gas flow through the detection gas line when the token green object shrinks during a sintering process in the furnace.

Sintering furnace

Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.

Nozzle arrangements and supply channels

In an example implementation, a method of operating a sintering furnace includes receiving information about a green object load to be sintered in a sintering furnace, determining a sintering profile based on the information, and performing a sintering process according to the sintering profile. During the sintering process, a sensor reading that indicates a degree of densification of a green object in the load is accessed from a densification sensor. The method includes initiating a cool down phase of the sintering process if the sensor reading has reached a target sensor reading.

Operating a sintering furnace

Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.

Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.

Nozzle arrangements and feed holes

Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.

An inkjet material dispenser system includes a printhead member. According to one exemplary embodiment, the printhead member includes at least one drop ejector including an insulating stack layer and a top orifice surface defining an orifice, wherein a ratio of a diameter of the orifice to a height of the insulating stack layer (O/L ratio) is at least 1.0.

System and method for creating a pico-fluidic inkjet

A slot extender includes a reservoir. The reservoir includes a reservoir floor defining a drain opening, a continuous reservoir sidewall extending from the reservoir floor, and a concave fillet running along at least a portion where the reservoir sidewall joins the reservoir floor. The concave fillet has a variable radius.

Reservoir with variable radius fillet

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Corvallis, OR, United States of America

Richard W Seaver