Bayer Corporation

Mobay Corporation

Richard W Mitesser

Merle W Lesko

Kristen L Parks

Peter W Boerner

Jeffrey F Dormish

Randall C Rains

Frank Sanns, Jr

The invention is directed to a process for preparing a Class-A surface, fiber reinforced molded article. The process broadly requires the use of two separate fiber surfacing veils with a fiber reinforcement sandwiched therebetween. A polyurethane reaction system is injected into the mold. The system requires the presence of specified hindered amines.

Injection molding fibers embedded in polyurethane with hindered amine

The present invention is directed to an improved internal mold release system for the production of high density molded SRIM parts, i.e. molded parts having a density of from 1.3 to 2.0 g/cc. In particular, the process includes reacting a reaction mixture including an organic polyisocyanate and at least one organic compound containing isocyanate-reactive hydrogens in the presence of a catalyst and an internal mold release agent in a closed mold. The internal mold release agent includes:

Process for the production of molded products using internal mold

A two component urethane structural adhesive formulation was developed containing a multi-functional aromatic amine terminated polyether as part of the curative component. The adhesive of the present invention is prepared by mixing and reacting the following low viscosity components: Component A, a curative comprising a polyol and an aromatic amine terminated polyether containing two or more primary amine groups and having a molecular weight of from 250 to about 10,000 and Component B, comprising a polyisocyanate. The adhesive of the invention is characterized by its improved sag resistance, its heavy body which is obtained without resort to included fillers or to prepolymerization of the components and by the relatively low viscosity (under about 15,000 cps) of its components which permits easy bulk handling.

Sag resistant, unfilled, low viscosity urethane structural adhesive

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Pittsburgh, PA, United States of America

Richard W Mitesser