General Electric Company

Richard W Kennedy

Edward G Tefft

Mike F Chang

Alfred Roesch

John K Boah

David K Hartman

Henri B Assalit

A p-type region is formed in a semiconductor body by diffusion of aluminum from an aluminum oxide source in an open tube process. Both ceramic aluminum oxide and sapphire sources are described and an inert atmosphere of argon and hydrogen provides stable results. An alternative embodiment provides both the deep diffusion characteristics of aluminum with the high surface concentration of boron by using a boron nitride wafer carrier.

Open tube aluminum oxide disc diffusion

A method for selectively diffusing a semiconductor body with p-conductivity type impurities utilizing aluminum as a diffusion source and able to be performed in a reuseable open diffusion tube is described. A gas flow is established in the diffusion tube which is essentially an inert gas and includes from one to ten percent oxygen. Simultaneous blanket and selective diffusions may be formed in accordance with this invention by modifying the amount of oxygen in the flow.

Selective open tube aluminum diffusion

Disclosed is a rectifier pellet and a method for the fabrication thereof. A layer of oxide is grown on a semiconductor wafer that has been diffused to form a plurality of rectifier pellets, and openings are etched in the oxide at locations corresponding to each pellet. Gold is diffused through the openings into a preselected distribution to reduce turnoff time. Grooves are etched to facilitate glass passivation and division of the wafer into pellets.

Glass passivated gold diffused rectifier pellet and method for making

Disclosed is a semiconductor device and a method for the manufacture thereof. A semiconductor wafer with three stacked regions is provided. An inner region exhibits one conductivity type and the two outer regions exhibit the opposite conductivity type. Isolation regions of the opposite conductivity type are formed by the temperature gradient zone melting process to separate the wafer into a plurality of device regions. Peripheral grooves are cut in one major surface in each device region. The grooves extend into the interior region thus electrically isolating the portion of the major surface within the grooves from the other major surface. The grooves are filled with a passivation material.

Method of manufacture of a semiconductor device

Semiconductor device and method of manufacture thereof

Producing glass passivated gold diffused rectifier pellets

Disclosed is a bidirectional triode thyristor pellet that comprises two current conductive regions and a gate region. Gold is diffused into the boundaries between the several regions to inhibit carrier migration thereacross and thus reduce turnoff time. Also disclosed is a method of fabricating the subject thyristor pellet that permits glass passivation thereof if desired.

Triac with gold diffused boundary

Disclosed is an SCR pellet and a method for the fabrication thereof. A layer of oxide is grown on a semiconductor wafer that has been diffused to form a plurality of SCR pellets and openings are etched in the oxide at locations corresponding to each pellet. Gold is diffused through the openings into a preselected distribution in the base region to reduce turnoff time. Grooves are etched to facilitate glass passivation and division of the wafer into pellets.

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Skaneateles, NY, United States of America

Richard W Kennedy