Nxp B.v.

Asm Technology Singapore Pte Ltd

Richard Van Lieshout

Guido Knippels

Paulus M C Hesen

Antonius J G M Van Den Berk

A wafer grooving apparatus () for forming an elongate recess () in a semiconductor wafer surface, the apparatus comprising: a wafer table () for receiving and holding a semiconductor wafer; a radiation device () for generating a radiation beam (); a beam directing device () for directing the radiation beam to a top surface () of the wafer so as to create a beam spot () where the radiation beam ablates wafer material on the wafer surface to form a recess; a wafer table displacement drive () for effecting a mutual displacement between the radiation beam and the wafer surface in a radiation beam displacement direction; a recess profile measuring device () arranged at a predetermined distance behind the beam directing device in the radiation beam displacement direction effected by the wafer table displacement drive for measuring a depth profile of the recess that has been formed by the radiation beam.

Method and device for grooving wafers

A method for manufacturing a microelectronic package () comprises the steps of providing two parts () comprising electrically insulating material such as plastic; providing members () comprising electrically conductive material; providing a microelectronic device (); positioning the electrically conductive members () and the microelectronic device () on the electrically insulating parts (); and placing the electrically insulating parts () against each other, wherein the microelectronic device () and portions of the electrically conductive members () are sandwiched between the electrically insulating parts (). The electrically conductive members () are intended to be used for realizing contact of the microelectronic device () arranged inside the package () to the external world. An important advantage of the method having steps as mentioned is that the electrically conductive members () as such are provided, wherein it is not necessary to provide a conventional lead frame which has the disadvantage of causing considerable waste of metal material during its manufacturing process.

Growing community of inventors

Batenburg, Netherlands

Richard Van Lieshout